TSM-139-01-TL-DV-P-TR SAMTEC Connector (Other) In Stock
Samtec TSM-139-01-TL-DV-P-TR is a 78-position dual-row surface mount terminal strip with 0.100" pitch featuring a top-left orientation for edge-mount board-to-board applications. Polarized dual-row design enables reliable high-density interconnection in industrial and computing systems. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- TSM-139-01-TL-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-139-01-TL-DV-P-TR?
- 78-position dual-row layout at 0.100" (2.54 mm) pitch supporting high-density mixed signal and power routing
- TL (top-left) orientation variant optimized for edge connector configurations and asymmetric board-to-board mating setups
- Tape-and-reel packaging enabling automated SMT pick-and-place assembly with compatible feeder systems for high-volume production
What is TSM-139-01-TL-DV-P-TR used for?
The TSM-139-01-TL-DV-P-TR is used in industrial backplane systems, embedded computing modules, and telecom line cards that require 78-position dual-row connectivity at 0.100" pitch in a top-left footprint orientation. Its surface mount construction and tape-and-reel packaging make it well suited for automated SMT assembly in production environments processing hundreds of boards per shift.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-139-01-TL-DV-P-TR datasheet?
TSM-139-01-TL-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-139-01-TL-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the TL orientation in TSM-139-01-TL-DV-P-TR differ from other orientation variants in the TSM-139 family?
The TL designation indicates a top-left housing orientation, which offsets the connector body's polarization key and alignment features toward the top-left of the mating face. This orientation is critical when two boards mate at a specific rotational angle or when the backplane layout positions the 78-pin connector at a corner, ensuring correct polarity without requiring additional keying pins or mechanical alignment pegs.
For a 78-signal backplane design, what board-to-board mating height does TSM-139-01-TL-DV-P-TR achieve when paired with a Samtec TW or SHF series header?
When mated with a compatible Samtec 0.100" pitch dual-row header such as the SHF or SSW series, the TSM-139-01-TL-DV-P-TR establishes a board-to-board mating height of approximately 4.8 mm to 8.5 mm depending on the selected header's post length. This range accommodates component clearance on the inner PCB surfaces in standard 1U and 2U rack-mounted industrial chassis.
What production volume threshold makes the tape-and-reel packaging of TSM-139-01-TL-DV-P-TR cost-effective compared to tray packaging?
Tape-and-reel packaging on TSM-139-01-TL-DV-P-TR becomes cost-effective at approximately 200 or more boards per production run, since the setup time for SMT feeders—typically 3 to 5 minutes per reel—is amortized across many placements. Below this threshold, tray-loaded manual placement is often faster; above it, feeder-based automated placement reduces per-unit labor cost by more than 60% compared to hand loading.
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