TSM-138-05-SS-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-138-05-SS-DV-P-TR is a 76-position dual-row surface-mount terminal strip with 0.100" (2.54 mm) pitch, designed for high-density SMT board-level interconnects. Its dual-row layout provides 76 signal connections in a compact footprint compatible with automated tape-and-reel SMT assembly processes.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- TSM-138-05-SS-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-138-05-SS-DV-P-TR?
- 76 positions in a dual-row surface-mount layout at 0.100" (2.54 mm) pitch for high-density SMT interconnect applications
- Tape-and-reel (TR) packaging enables automated SMT pick-and-place assembly for high-volume PCB manufacturing
- Surface-mount termination eliminates through-hole drilling and supports fine-pitch high-contact-count board-level connections
What is TSM-138-05-SS-DV-P-TR used for?
The TSM-138-05-SS-DV-P-TR is designed for high-density board-to-board and board-to-cable surface-mount interfaces in embedded computing, communications infrastructure, and industrial control modules. Its 76-position count at 2.54 mm pitch accommodates parallel data buses, multi-channel analog I/O, and mixed signal/power interfaces on a single connector. The tape-and-reel format supports high-volume automated assembly lines with consistent placement accuracy.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-138-05-SS-DV-P-TR datasheet?
TSM-138-05-SS-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-138-05-SS-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact count and pitch of the TSM-138-05-SS-DV-P-TR, and why does the dual-row layout matter?
The TSM-138-05-SS-DV-P-TR provides 76 contacts arranged in 2 rows at 0.100" (2.54 mm) pitch. The dual-row layout doubles the contact density compared to a single-row strip of the same length, enabling a 76-circuit interface within a board footprint approximately half as long as a single-row equivalent.
How does tape-and-reel packaging benefit the TSM-138-05-SS-DV-P-TR in high-volume SMT production?
The TR (tape-and-reel) packaging of the TSM-138-05-SS-DV-P-TR allows it to be loaded directly onto standard SMT pick-and-place feeders, enabling automated placement at throughputs compatible with mass production. This eliminates manual insertion steps, reduces placement errors, and supports consistent solder joint quality on 76-contact dual-row SMT footprints.
Which embedded systems or control boards are best served by the 76-position TSM-138-05-SS-DV-P-TR?
Embedded single-board computers, FPGA evaluation boards, and industrial PLC I/O expansion modules with 64-bit to 76-bit parallel interfaces benefit most from the TSM-138-05-SS-DV-P-TR. Its 76 contacts at 2.54 mm pitch accommodate full 64-bit data buses plus additional power, ground, and control signals within a single standardized 0.100" pitch SMT connector.
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