TSM-138-03-L-DV-P-TR SAMTEC Connector (Other) In Stock

SAMTEC TSM-138-03-L-DV-P-TR is a 76-position dual-row surface-mount terminal strip with 2.54 mm (0.100") pitch, designed for reliable PCB-to-board signal interconnects. It features low-profile SMT mounting compatible with standard reflow soldering and tape-and-reel packaging for automated assembly. Available globally with consistent lead times for high-volume production.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TSM-138-03-L-DV-P-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
76
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 76-position dual-row layout with 2.54 mm (0.100") pitch provides high pin-density signal routing in a compact SMT footprint
  • Tape-and-reel (TR) packaging enables automated pick-and-place assembly for high-volume PCB production runs
  • Low-profile SMD surface-mount design with dual-row configuration supports dense board-to-board or mezzanine connections

Applications

The TSM-138-03-L-DV-P-TR is used in backplane interconnect systems, test and measurement equipment, and industrial control boards where a 76-position, 2.54 mm pitch dual-row SMT strip provides reliable high-density signal routing. Its tape-and-reel packaging makes it well-suited for high-volume automated assembly lines in telecommunications and computing hardware. The surface-mount form factor integrates easily with standard PCB reflow soldering processes, reducing manual assembly costs.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Datasheet

TSM-138-03-L-DV-P-TR Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many positions and rows does the TSM-138-03-L-DV-P-TR provide, and what is its pitch?

The TSM-138-03-L-DV-P-TR has 76 positions arranged in a dual-row configuration with a 2.54 mm (0.100") pitch, providing dense signal routing capacity for backplane and board-to-board interconnect applications requiring many parallel connections in a compact SMT footprint.

Is TSM-138-03-L-DV-P-TR compatible with automated pick-and-place assembly, and what packaging does it use?

Yes, the part ships in tape-and-reel (TR) packaging specifically designed for automated pick-and-place equipment, supporting high-volume SMT assembly lines with standard reflow soldering at typical peak temperatures above 245°C per IPC standards.

What applications benefit most from the dual-row 76-position layout of TSM-138-03-L-DV-P-TR?

High-density signal interconnect applications such as FPGA evaluation boards, server backplanes, and test fixture interfaces benefit from the 76-position dual-row 2.54 mm pitch layout, which consolidates up to 76 signal lines into a single SMT connector with consistent electrical spacing and low crosstalk.

How does TSM-138-03-L-DV-P-TR compare to through-hole alternatives for board-to-board connections?

Unlike through-hole alternatives that require wave soldering and drilled vias, the TSM-138-03-L-DV-P-TR uses SMD pads on a 2.54 mm grid, eliminating via drilling costs, reducing board layer constraints, and enabling placement on both sides of a PCB for space-efficient dual-row 76-pin signal buses.

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About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Response time is incredible — usually under 4 hours. They understand that production lines can't wait.

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James Wright
Supply Chain Director, CircuitPro Ltd, UK