TSM-138-03-L-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-138-03-L-DV-P-TR is a 76-position dual-row surface-mount terminal strip with 2.54 mm (0.100") pitch, designed for reliable PCB-to-board signal interconnects. It features low-profile SMT mounting compatible with standard reflow soldering and tape-and-reel packaging for automated assembly. Available globally with consistent lead times for high-volume production.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- TSM-138-03-L-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-138-03-L-DV-P-TR?
- 76-position dual-row layout with 2.54 mm (0.100") pitch provides high pin-density signal routing in a compact SMT footprint
- Tape-and-reel (TR) packaging enables automated pick-and-place assembly for high-volume PCB production runs
- Low-profile SMD surface-mount design with dual-row configuration supports dense board-to-board or mezzanine connections
What is TSM-138-03-L-DV-P-TR used for?
The TSM-138-03-L-DV-P-TR is used in backplane interconnect systems, test and measurement equipment, and industrial control boards where a 76-position, 2.54 mm pitch dual-row SMT strip provides reliable high-density signal routing. Its tape-and-reel packaging makes it well-suited for high-volume automated assembly lines in telecommunications and computing hardware. The surface-mount form factor integrates easily with standard PCB reflow soldering processes, reducing manual assembly costs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-138-03-L-DV-P-TR datasheet?
TSM-138-03-L-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-138-03-L-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the TSM-138-03-L-DV-P-TR provide, and what is its pitch?
The TSM-138-03-L-DV-P-TR has 76 positions arranged in a dual-row configuration with a 2.54 mm (0.100") pitch, providing dense signal routing capacity for backplane and board-to-board interconnect applications requiring many parallel connections in a compact SMT footprint.
Is TSM-138-03-L-DV-P-TR compatible with automated pick-and-place assembly, and what packaging does it use?
Yes, the part ships in tape-and-reel (TR) packaging specifically designed for automated pick-and-place equipment, supporting high-volume SMT assembly lines with standard reflow soldering at typical peak temperatures above 245°C per IPC standards.
What applications benefit most from the dual-row 76-position layout of TSM-138-03-L-DV-P-TR?
High-density signal interconnect applications such as FPGA evaluation boards, server backplanes, and test fixture interfaces benefit from the 76-position dual-row 2.54 mm pitch layout, which consolidates up to 76 signal lines into a single SMT connector with consistent electrical spacing and low crosstalk.
How does TSM-138-03-L-DV-P-TR compare to through-hole alternatives for board-to-board connections?
Unlike through-hole alternatives that require wave soldering and drilled vias, the TSM-138-03-L-DV-P-TR uses SMD pads on a 2.54 mm grid, eliminating via drilling costs, reducing board layer constraints, and enabling placement on both sides of a PCB for space-efficient dual-row 76-pin signal buses.
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