TSM-138-03-G-DV-P-TR SAMTEC Connector (Other) In Stock
The TSM-138-03-G-DV-P-TR is a 76-position dual-row 0.100-inch pitch surface-mount terminal strip from SAMTEC featuring gold-plated contacts for reliable low-resistance connections. It supports standard 2.54 mm pitch spacing for board-to-board and backplane interconnects. Available from stock worldwide in tape-and-reel packaging.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- TSM-138-03-G-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-138-03-G-DV-P-TR?
- 76-position dual-row design at 0.100-inch (2.54 mm) pitch provides high-density signal routing on standard SMT grids
- Gold-plated (G suffix) contacts ensure low contact resistance and long-term corrosion resistance in demanding environments
- Tape-and-reel (TR suffix) packaging enables automated pick-and-place for high-volume SMT assembly
What is TSM-138-03-G-DV-P-TR used for?
The TSM-138-03-G-DV-P-TR is used in industrial control systems, networking switches, and test-and-measurement equipment requiring reliable 76-pin dual-row board-to-board connectivity on a 0.100-inch pitch. Its gold contact finish makes it suitable for high-cycle applications and environments where oxidation resistance is critical to long-term signal integrity.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-138-03-G-DV-P-TR datasheet?
TSM-138-03-G-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-138-03-G-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-138-03-G-DV-P-TR offer and what contact finish does it use?
The TSM-138-03-G-DV-P-TR provides 76 positions in a dual-row surface-mount layout on a 0.100-inch (2.54 mm) pitch. The G suffix specifies gold-plated contacts, which deliver lower and more stable contact resistance than tin alternatives, making them suitable for high-reliability and high-cycle-count interconnect applications.
What assembly process is compatible with the TSM-138-03-G-DV-P-TR and how is it packaged for production?
The connector uses surface-mount termination compatible with standard SMT reflow soldering at typical profiles up to 260°C. The TR suffix indicates tape-and-reel packaging for automated pick-and-place equipment, streamlining high-volume PCB assembly and minimizing handling errors in production environments.
In which board-stacking or backplane designs is the TSM-138-03-G-DV-P-TR a suitable choice?
This 76-pin dual-row terminal strip fits backplane interconnect applications in telecommunications chassis, industrial PLC racks, and modular embedded computing systems. Its 2.54 mm pitch aligns with standard header grids, and the gold contact finish ensures reliable signal continuity over thousands of mating cycles in rack-mounted hardware.
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