TSM-137-01-STL-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-137-01-STL-DV-P-TR is a 74-position dual-row surface-mount terminal strip with 0.100" (2.54 mm) pitch featuring a short tail length and dual-voltage rated contacts with peelable protective cover. Designed for high-density SMT board-to-board and cable-to-board interconnect applications. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- TSM-137-01-STL-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74-position dual-row layout at 0.100" (2.54 mm) pitch providing 37 pins per row for high-density SMT interconnects
- Dual-voltage (DV) rated contacts supporting mixed signal and power connections in a single connector
- Peelable (P) protective cover keeps 74 contact cavities clean during PCB reflow and prevents solder contamination
- Tape-and-reel (TR) packaging enables automated high-speed pick-and-place assembly for high-volume production
Applications
TSM-137-01-STL-DV-P-TR is used in high-density board-to-board interconnect systems in server backplanes, industrial computing modules, and test and measurement equipment requiring 74 signal or mixed-power connections in a compact SMT footprint. The dual-row 0.100" pitch design allows routing of up to 74 independent signals across a single 37×2 connector, making it suitable for FPGA daughter-card interfaces, data acquisition module headers, and memory expansion board connectors. Tape-and-reel delivery with a peelable cover supports fully automated assembly in high-volume electronics manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does TSM-137-01-STL-DV-P-TR provide per row, and what pitch is used for board-to-board signal routing?
TSM-137-01-STL-DV-P-TR provides 74 total positions arranged in a dual-row configuration of 37 pins per row at 0.100" (2.54 mm) pitch. This layout allows up to 74 independent signal or power connections in a single SMT connector, making it well suited for FPGA daughter-card headers and data acquisition module interfaces that require more than 50 pins.
What does the peelable cover designation (P) in TSM-137-01-STL-DV-P-TR protect during PCB assembly?
The peelable (P) protective cover seals all 74 contact cavities of the terminal strip during PCB reflow soldering, preventing solder flux from contaminating the female contact area. The cover is removed after solder reflow is complete, leaving clean contacts ready for mating. This feature is critical in lead-free no-clean solder processes where flux residue inside the 0.100" pitch contact cavities would increase insertion force and degrade contact resistance above the 20 mΩ specification.
When should an engineer choose TSM-137-01-STL-DV-P-TR over a lower pin-count alternative for a backplane design?
TSM-137-01-STL-DV-P-TR is the right choice when a design requires more than 50 connections but must remain within a single 0.100" pitch dual-row connector footprint rather than using two smaller connectors. For backplane designs with 74 differential pairs, LVDS data lines, or mixed 3.3 V signal and 12 V power rails, consolidating all connections into one 74-position dual-voltage rated connector reduces connector cost by 30 to 40% and simplifies PCB routing compared to two parallel 37-pin connectors.
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