TSM-137-01-S-DV-P SAMTEC Connector (Other) In Stock
The TSM-137-01-S-DV-P is a 74-position dual-row surface-mount terminal strip from Samtec with 0.100" (2.54 mm) pitch. It features solderable SMT contacts in a vertical dual-row layout for reliable high pin-count board connections. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- TSM-137-01-S-DV-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-137-01-S-DV-P?
- 74-position dual-row SMT terminal strip on 0.100" (2.54 mm) pitch for high pin-count board-to-board signal routing
- Surface-mount vertical configuration supports automated reflow soldering, eliminating through-hole drilling and wave soldering steps
- Dual-row layout maximizes contact density per unit of board length at standard 0.100" pitch spacing
What is TSM-137-01-S-DV-P used for?
The TSM-137-01-S-DV-P is used in industrial automation, embedded computing, and test equipment where a high pin-count 0.100" SMT terminal strip is needed on a single connector. Its 74 dual-row positions allow simultaneous routing of both signal and power lines, reducing the connector count on dense PCBs. The vertical SMT orientation also enables efficient pick-and-place assembly in high-volume manufacturing environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-137-01-S-DV-P datasheet?
TSM-137-01-S-DV-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-137-01-S-DV-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the total pin count and row arrangement of the TSM-137-01-S-DV-P?
The TSM-137-01-S-DV-P provides 74 positions arranged in 2 rows of 37 contacts, on a 0.100" (2.54 mm) pitch. This high pin count in a dual-row format allows engineers to carry a large number of signals and power lines on a single 0.100" pitch SMT connector, reducing board complexity.
How does the TSM-137-01-S-DV-P fit into an automated SMT assembly process?
The TSM-137-01-S-DV-P is designed for surface-mount reflow soldering, allowing it to be placed by standard pick-and-place machines and reflowed alongside other SMT components. This eliminates the need for a separate through-hole soldering pass, which reduces manufacturing cycle time and is particularly beneficial for high-volume production of 74-pin connector assemblies in industrial or computing products.
Is the TSM-137-01-S-DV-P a practical alternative to a 74-pin through-hole dual-row header on a mixed-technology PCB?
Yes, when a PCB is designed for full SMT assembly without through-hole components, the TSM-137-01-S-DV-P is a direct surface-mount alternative to a through-hole 74-pin dual-row header at 0.100" pitch. It removes the need for 74 drilled via holes, saving laminate area on 6-layer or 8-layer boards and simplifying the fabrication panel for lower-cost PCB manufacturing.
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