TSM-136-04-T-DH-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-136-04-T-DH-P-TR is a 72-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch, providing high signal count board-to-board connectivity with tape-and-reel packaging for automated SMT assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 72
- Lifecycle
- ACTIVE
- Datasheet
- TSM-136-04-T-DH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 72-position dual-row layout at 0.100" (2.54 mm) pitch for very high signal density SMT board interconnect
- Tape-and-reel (TR suffix) packaging enables automated pick-and-place SMT assembly in high-volume production
- Surface mount termination compatible with standard lead-free reflow soldering processes
- Dual-row configuration delivers 72 contacts in a single compact connector footprint
- Gold-plated contact finish ensures low contact resistance and reliable signal integrity
- Designed for demanding backplane, computing, and industrial I/O applications requiring high channel counts
Applications
The TSM-136-04-T-DH-P-TR is well suited for high-channel-count board-to-board interconnect in backplane systems, FPGA development platforms, and embedded computing modules requiring 72 signal connections in a surface mount dual-row format. Its tape-and-reel packaging and 0.100 inch pitch standard make it efficient for automated production in telecommunications infrastructure, industrial control, and high-performance data acquisition systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact count and pitch does TSM-136-04-T-DH-P-TR offer for backplane and module designs?
The TSM-136-04-T-DH-P-TR provides 72 positions at 0.100 inch (2.54 mm) pitch in a dual-row surface mount format. This high channel count allows engineers to route 72 individual signals through a single connector, making it appropriate for backplane interconnects, FPGA I/O expansion, and multi-channel industrial controllers.
How does tape-and-reel packaging benefit production runs using TSM-136-04-T-DH-P-TR?
Tape-and-reel packaging allows TSM-136-04-T-DH-P-TR to be loaded directly into automated pick-and-place machines without manual intervention. This reduces placement error risk for the 72-position dual-row footprint and supports efficient reflow soldering at peak temperatures around 260°C, lowering per-unit assembly cost in volume SMT production.
When would a designer choose TSM-136-04-T-DH-P-TR over a lower-count 58-position or 68-position SAMTEC strip?
TSM-136-04-T-DH-P-TR is selected when the interface requires 72 or more signal lines on a single 0.100 inch pitch connector. Designs such as high-density FPGA breakout cards, large-format backplanes, or multi-axis motor controllers often exceed 58 or 68 pins, requiring the 72-position variant to consolidate all signals without adding a second connector.
What compliance features make TSM-136-04-T-DH-P-TR suitable for modern electronics manufacturing?
SAMTEC TSM-series connectors are manufactured with RoHS-compliant, lead-free materials. The termination finish is compatible with lead-free solder pastes and standard SMT reflow profiles peaking around 260°C, aligning with EU RoHS 2 directives and similar global compliance standards for electronics exported to regulated markets.
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