TSM-136-04-L-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-136-04-L-DH-A-K-TR is a 72-position, dual-row, surface-mount terminal strip with 0.100" (2.54 mm) pitch, designed for high-density PCB interconnects. Features through-hole solder tail and tape-and-reel packaging for automated assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 72
- Lifecycle
- ACTIVE
- Datasheet
- TSM-136-04-L-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 72 positions in a dual-row surface-mount configuration at 0.100" (2.54 mm) pitch
- Compatible with tape-and-reel (TR) packaging for automated SMT pick-and-place assembly
- Dual-row (DH) design maximizes pin density in minimal board footprint
- Low-profile terminal strip suitable for high-density PCB interconnects
- RoHS compliant with gold or tin contact finish options
Applications
The TSM-136-04-L-DH-A-K-TR is widely used in high-density PCB interconnect applications such as backplane systems, memory modules, and daughtercard-to-motherboard connections. Its dual-row, 72-position configuration suits industrial automation equipment, test and measurement instruments, and telecommunications hardware requiring reliable board-to-board signal routing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-136-04-L-DH-A-K-TR provide and what is its pitch?
The TSM-136-04-L-DH-A-K-TR provides 72 positions arranged in a dual-row layout with a 0.100" (2.54 mm) pitch, making it suitable for high-density PCB interconnect designs where many signals must be routed in a compact board area.
Which PCB assembly methods are compatible with the TSM-136-04-L-DH-A-K-TR, and does it support automated placement?
The TSM-136-04-L-DH-A-K-TR is packaged in tape-and-reel (TR) format, enabling automated SMT pick-and-place assembly. The surface-mount footprint is compatible with standard reflow solder processes, reducing assembly time for high-volume production runs of 100 units or more.
What board-to-board interconnect scenarios benefit most from a 72-position dual-row terminal strip like this SAMTEC part?
Backplane systems, memory modules, and daughtercard connections benefit most, as the 72-position dual-row layout routes a large number of signals, up to 36 pins per row, while keeping the occupied PCB footprint to a minimum compared to single-row alternatives.
Is the TSM-136-04-L-DH-A-K-TR RoHS compliant, and what contact finish should engineers specify for long-term reliability?
SAMTEC's TSM series, including this part, is RoHS compliant and lead-free. The -K suffix in the MPN typically denotes a tin (Sn) contact finish, which supports operating temperatures up to 105°C and provides reliable solder joint integrity in most industrial environments.
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