TSM-136-03-SM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-136-03-SM-DH-A-K-TR is a 72-position dual-row surface-mount terminal strip with 2.54 mm (0.100") pitch, offering reliable PCB-to-board connectivity for backplane, instrumentation, and high-density signal routing applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 72
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-136-03-SM-DH-A-K-TR?
- 72 positions (36 per row) dual-row layout for high-density signal routing
- 2.54 mm (0.100 inch) standard pitch compatible with common PCB grid systems
- Surface-mount (SM) termination style supports automated SMT assembly
- Gold-plated contacts for low contact resistance and corrosion resistance
- Tape-and-reel (TR) packaging for high-volume automated pick-and-place manufacturing
What is TSM-136-03-SM-DH-A-K-TR used for?
TSM-136-03-SM-DH-A-K-TR is designed for high-density board-to-board and wire-to-board connections in instrumentation, test and measurement equipment, and industrial backplane systems. Its 72-position dual-row configuration with 2.54 mm pitch makes it well suited for FPGA daughter cards, mezzanine modules, and embedded computing platforms where reliable signal integrity across 72 pins is critical.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-136-03-SM-DH-A-K-TR datasheet?
TSM-136-03-SM-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-136-03-SM-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal lines can TSM-136-03-SM-DH-A-K-TR support in a dual-row backplane design?
TSM-136-03-SM-DH-A-K-TR provides 72 total positions arranged in 2 rows of 36 contacts each, all on a 2.54 mm pitch. This allows routing up to 72 independent signal lines in a single connector footprint, making it practical for FPGA I/O expansion or backplane bus architectures.
Does the tape-and-reel packaging of TSM-136-03-SM-DH-A-K-TR support high-volume SMT production lines?
Yes. The -TR suffix designates tape-and-reel packaging, which is fully compatible with standard pick-and-place equipment operating at high placement rates. Each reel holds hundreds of 72-position connectors, reducing feed changeover time and enabling efficient SMT production runs of thousands of units.
When should engineers choose TSM-136-03-SM-DH-A-K-TR over a through-hole terminal strip for an instrumentation board?
Surface-mount connectors like TSM-136-03-SM-DH-A-K-TR are preferred when both sides of the PCB must be used for components, as the SMD footprint eliminates 72 through-holes that would otherwise block routing layers. This is especially valuable in dense multi-layer designs with 4 or more layers where via density is a limiting constraint.
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