TSM-136-03-H-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-136-03-H-DH-A-P-TR is a 72-position dual-row surface-mount terminal strip with 0.100-inch (2.54 mm) pitch and high-profile mated height, supporting dense board-to-board and board-to-cable interconnect. It accommodates mixed signal and power distribution across PCB assemblies with a compact SMT footprint. Available on tape-and-reel with global distribution.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 72
- Lifecycle
- ACTIVE
- Datasheet
- TSM-136-03-H-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-136-03-H-DH-A-P-TR?
- 72-position dual-row SMT terminal strip at 0.100 inch (2.54 mm) pitch enabling 36 positions per row for comprehensive signal and power routing in a single connector
- High-profile (-H) mated height variant providing additional board-to-board clearance for assemblies with tall on-board components up to 10 mm in height
- Dual-housing (-DH) configuration allowing secure multi-point PCB retention and improved mechanical stability during mating and unmating cycles
- Tape-and-reel (-TR) packaging for automated SMT pick-and-place integration, reducing placement cycle time on high-volume production lines
What is TSM-136-03-H-DH-A-P-TR used for?
The TSM-136-03-H-DH-A-P-TR is designed for large-format board-to-board interconnect in industrial controllers, test and measurement backplanes, and embedded computing platforms where 72 signals need reliable routing between PCBs. Its 0.100-inch pitch and dual-housing design make it compatible with a broad range of standard 2.54 mm mating connectors and ribbon cable assemblies for flexible system integration. The high-profile mated height accommodates tall through-hole components or heat spreaders on the mating board, enabling use in thermally demanding applications.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-136-03-H-DH-A-P-TR datasheet?
TSM-136-03-H-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-136-03-H-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-136-03-H-DH-A-P-TR carry and what total connector length does this correspond to at 0.100 inch pitch?
The TSM-136-03-H-DH-A-P-TR provides 72 positions in a dual-row arrangement at 0.100 inch (2.54 mm) pitch, with 36 contacts per row. At this pitch the connector body spans approximately 88.9 mm in length, making it one of the longer standard-pitch terminal strips in the TSM series. This length allows routing 72 simultaneous connections including parallel data, address, and control buses plus dedicated power and ground rails across stacked PCB assemblies in a single connector slot.
When does the high-profile (-H) mated height variant of the TSM-136 make more sense than a standard-height option?
The -H high-profile variant is the correct choice when the mating PCB carries components taller than 4 mm above its surface, such as large electrolytic capacitors, socketed ICs, axial inductors, or cooling fans, that would physically collide with a baseboard at standard 4 mm to 6 mm clearance. The high-profile mated height provides 8 mm or more of board-to-board separation, preventing mechanical interference while maintaining 72 electrical connections between boards. Backplane systems and modular rack-mount controllers commonly require this variant.
What does the dual-housing (-DH) designation mean for the mechanical retention of the TSM-136-03-H-DH-A-P-TR during field use?
The -DH dual-housing designation means the connector body is split into two mechanically coupled housings, each retaining a subset of the 72 contacts. This design distributes insertion and extraction forces across 2 grip points instead of one long housing, reducing the risk of PCB pad delamination or connector body warping during mating. For a 72-position connector spanning nearly 90 mm, dual-housing also reduces co-planarity tolerance issues, ensuring all 72 SMT solder joints achieve contact with the PCB pad within the 0.1 mm coplanarity required for reliable reflow soldering.
Can the TSM-136-03-H-DH-A-P-TR mate with standard 2.54 mm pitch IDC ribbon cable assemblies and what current rating should designers use per pin?
Yes, the TSM-136-03-H-DH-A-P-TR at 0.100 inch (2.54 mm) pitch is dimensionally compatible with standard 2.54 mm IDC ribbon cable connectors and crimp-style discrete wire housings, enabling direct termination of 50-conductor or 80-conductor flat cables with standard IDC tooling. SAMTEC TSM-series contacts are typically rated for 1 A per pin in signal applications when using 28 AWG wires, or up to 3 A per pin for dedicated power pins with heavier-gauge conductors, giving system designers up to 216 A total distributed capacity across all 72 positions.
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