TSM-136-03-F-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-136-03-F-DH-A-K-TR is a 72-position, 0.100" pitch surface-mount terminal strip with fine-pitch single-row double-height body, keyed polarization, and tape-and-reel packaging for automated assembly. High-contact-count gold-plated design supports reliable board-edge interconnect in dense computing and industrial systems. Available in stock worldwide for immediate global shipment.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 72
- Lifecycle
- ACTIVE
- Datasheet
- TSM-136-03-F-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 72-position 0.100" pitch single-row SMT terminal strip — one of the highest contact counts in the TSM series for maximum I/O density
- Keyed (K) polarization and fine-pitch (F) leads prevent mis-mating while enabling compact PCB land patterns
- Double-height (DH) double-row (A) body in tape-and-reel (TR) format streamlines high-volume automated SMT production
Applications
The TSM-136-03-F-DH-A-K-TR is suited for high-I/O computing modules, industrial communication backplanes, and data acquisition systems requiring 72 surface-mount contacts at 0.100" pitch in a single-row configuration. Its double-height keyed design provides daughter-card clearance and assembly error-proofing in complex multi-board enclosures. Tape-and-reel delivery supports efficient automated SMT placement for production volumes where per-connector handling cost must be minimized.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Why select TSM-136-03-F-DH-A-K-TR over a 68-position connector when designing a high-I/O industrial backplane?
Selecting TSM-136-03-F-DH-A-K-TR over a 68-position variant adds 4 extra positions — a 5.9% increase in contact count — within the same 0.100 inch pitch single-row format, providing spare contacts for power return paths, chassis ground, or future signal expansion without changing the connector series or PCB footprint. On a 72-position backplane this headroom can accommodate a full 8-bit parallel bus alongside 64 signal contacts without redesigning the card edge.
How does the fine-pitch (F) termination of TSM-136-03-F-DH-A-K-TR benefit high-density multilayer PCB designs?
The fine-pitch (F) lead style on TSM-136-03-F-DH-A-K-TR reduces the SMT pad width compared to standard leads, allowing via-in-pad or via-adjacent routing between the 72 connector pads on PCBs with 4 or more layers at a 0.1 mm minimum trace spacing. This is advantageous in designs where 72 signals must break out through a tight connector footprint to inner-layer routing channels without exceeding 0.100 inch pitch pad center spacing.
What mating height options are available when pairing TSM-136-03-F-DH-A-K-TR with a SAMTEC receptacle for daughter-card stacking?
TSM-136-03-F-DH-A-K-TR pairs with SAMTEC SSW or TSW series keyed receptacles at 0.100 inch pitch, offering selectable mating heights from approximately 8.5 mm to 15 mm above the main PCB surface depending on the receptacle body height chosen. The 72-position double-height format accommodates daughter cards with up to 10 mm thick components mounted on the underside when using a 15 mm stacking height, suitable for compact multi-board industrial computing enclosures.
At what production volume does the tape-and-reel packaging of TSM-136-03-F-DH-A-K-TR deliver the best per-unit cost advantage?
Tape-and-reel packaging on TSM-136-03-F-DH-A-K-TR delivers the best per-unit cost advantage at production volumes above 500 units per run, where automated pick-and-place placement at rates of 300 to 600 components per hour reduces the per-connector labor cost to under 0.05 USD compared to 0.20 to 0.50 USD for manual tube or tray handling of 72-pin connectors. The TR format also reduces lead time variability for scheduled SMT production orders.
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