TSM-136-01-STL-DH-A-P-TR SAMTEC Connector (Other) In Stock
Samtec TSM-136-01-STL-DH-A-P-TR is a 72-position, 2.54 mm (0.100 inch) pitch single-row surface-mount terminal strip with dual-height dual-housing design and tape-and-reel packaging for high-volume PCB assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 72
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 72-position single-row layout at 2.54 mm (0.100 inch) pitch maximizes connection density on surface-mount PCBs
- Dual-height dual-housing (DH) configuration provides mechanical stability and secure mating for demanding board-level interconnect
- Tape-and-reel (TR) packaging supports automated pick-and-place assembly, reducing per-unit placement time in high-volume production
Applications
The TSM-136-01-STL-DH-A-P-TR is designed for high-density surface-mount interconnects in backplane systems, server boards, and industrial automation controllers that demand 72 positions within a 0.100 inch pitch footprint. Its dual-height housing is ideal for applications requiring vertical clearance control over adjacent components. The tape-and-reel form factor supports seamless integration into fully automated SMT assembly lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-136-01-STL-DH-A-P-TR provide, and what is its pitch?
The TSM-136-01-STL-DH-A-P-TR offers 72 positions arranged in a single row at a 2.54 mm (0.100 inch) pitch. This standard pitch ensures compatibility with widespread PCB footprint libraries and mating connectors commonly used across industrial, computing, and communications platforms.
For a high-density backplane design, how does the dual-height housing of this Samtec connector help manage PCB clearance?
The dual-height (DH) housing design provides two distinct mating heights, allowing engineers to select a profile that clears neighboring components within board-to-board stacking configurations. This flexibility is critical in backplane assemblies where component height tolerance is typically constrained to within 1 mm to 3 mm above the PCB surface.
When should a designer choose TSM-136-01-STL-DH-A-P-TR over a through-hole equivalent?
Surface-mount termination eliminates through-hole drilling cost and enables double-sided PCB population, reducing board thickness by typically 0.4 mm to 0.8 mm compared to through-hole alternatives. The tape-and-reel packaging also allows fully automated placement at line speeds exceeding 10,000 components per hour, making this connector the better choice in cost-sensitive, high-volume programs.
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