TSM-135-04-TM-DH-A-K-TR SAMTEC Connector (Other) In Stock
Samtec TSM-135-04-TM-DH-A-K-TR is a 70-position, 0.100-inch pitch surface-mount terminal strip in a dual-row through-mount configuration for robust board-to-board interconnect. It features precision-formed contacts with tape-and-reel packaging suitable for high-volume automated SMT assembly. Available from stock with worldwide shipping for industrial and computing applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-135-04-TM-DH-A-K-TR?
- 70 positions in dual-row layout on 0.100 inch (2.54 mm) pitch for versatile connectivity
- Surface-mount terminal strip design compatible with standard SMT reflow processes
- Tape-and-reel (TR) packaging enables high-volume automated pick-and-place assembly
- Through-mount (TM) termination style provides additional mechanical anchoring to PCB
- Double-height (DH) body style accommodates mating header height requirements
- Samtec high-reliability contact design for consistent signal performance in industrial systems
What is TSM-135-04-TM-DH-A-K-TR used for?
Samtec TSM-135-04-TM-DH-A-K-TR is suited for high-density board-to-board interconnect in industrial automation, server infrastructure, and communications equipment where a 70-position, 0.100-inch pitch interface is required. The dual-row terminal strip supports modular PCB designs such as CPU daughter cards, FPGA carrier boards, and backplane expansion slots that require reliable signal transmission across 70 pins. Its surface-mount and through-mount hybrid termination provides enhanced board retention for applications subject to vibration or mechanical stress.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-135-04-TM-DH-A-K-TR datasheet?
TSM-135-04-TM-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-135-04-TM-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the dual-row, 70-position layout of TSM-135-04-TM-DH-A-K-TR compare to single-row alternatives for backplane designs?
The dual-row configuration of TSM-135-04-TM-DH-A-K-TR provides 70 contacts at 0.100 inch (2.54 mm) pitch in a compact footprint roughly half the PCB length of an equivalent single-row 70-position strip. This density is advantageous for FPGA carrier boards and backplane designs where routing multiple signal, power, and ground pins within a constrained board edge is required.
Does the through-mount (TM) termination in TSM-135-04-TM-DH-A-K-TR improve mechanical retention for vibration-prone environments?
Yes, the through-mount (TM) termination style anchors the TSM-135-04-TM-DH-A-K-TR body through the PCB, adding mechanical strength beyond surface-mount solder joints alone. This hybrid attachment is particularly beneficial in industrial automation and transportation electronics where 70-pin connector assemblies are exposed to continuous vibration at frequencies typically ranging from 10 Hz to 2000 Hz.
What is the pitch of TSM-135-04-TM-DH-A-K-TR, and which mating headers are compatible with it?
TSM-135-04-TM-DH-A-K-TR uses the standard 0.100 inch (2.54 mm) pitch, which is compatible with Samtec TW, TSW, and M20 series pin headers as well as industry-standard 2.54 mm dual-row headers from other manufacturers. The 70-position, dual-row layout mates with 35-pin-per-row headers commonly used in embedded computing, test fixtures, and prototyping backplanes.
How does tape-and-reel packaging for TSM-135-04-TM-DH-A-K-TR benefit high-volume SMT production?
The TR suffix indicates tape-and-reel packaging, which feeds TSM-135-04-TM-DH-A-K-TR directly into automated SMT pick-and-place machines without manual handling. This eliminates orientation errors on 70-position connectors and supports production rates exceeding thousands of placements per hour, reducing assembly labor costs and improving board yield for high-volume industrial and computing applications.
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