TSM-135-04-TL-SH-A SAMTEC Connector (Other) In Stock
SAMTEC TSM-135-04-TL-SH-A is a 35-position dual-row .100" pitch surface mount terminal strip with single-row horizontal mating. Gold-plated contacts deliver consistent low-resistance connections. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 35
- Lifecycle
- ACTIVE
- Datasheet
- TSM-135-04-TL-SH-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-135-04-TL-SH-A?
- 35-position dual-row SMT configuration on .100" (2.54 mm) pitch supporting high-density signal routing in compact PCB designs
- Single-row horizontal mating direction enabling low-profile board-to-board interconnect with minimal vertical clearance requirements
- Gold-plated contacts providing corrosion resistance and contact resistance below 20 milliohms for high-reliability signal transmission
What is TSM-135-04-TL-SH-A used for?
The TSM-135-04-TL-SH-A is well suited for board-to-board signal interconnect in embedded systems, industrial controllers, and communications equipment. Its 35-position dual-row surface mount design supports dense signal routing while maintaining a small PCB footprint. The horizontal mating profile enables use in thin or stacked PCB enclosures with height restrictions.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-135-04-TL-SH-A datasheet?
TSM-135-04-TL-SH-A Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-135-04-TL-SH-A?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the key mechanical parameters of the TSM-135-04-TL-SH-A terminal strip?
The TSM-135-04-TL-SH-A features 35 positions in a dual-row layout with a .100" (2.54 mm) contact pitch. It uses a surface mount termination style and a single-row horizontal mating direction, making the total mated height approximately 8.5 mm above the PCB surface, suitable for low-profile enclosures.
Which embedded computing or industrial platforms benefit most from the TSM-135-04-TL-SH-A?
Industrial single-board computers, motion control cards, and FPGA-based development boards benefit most from the TSM-135-04-TL-SH-A. These platforms frequently require 35 or more signal lines between stacked boards, and the SMT footprint allows fully automated placement during high-volume PCB assembly without manual through-hole insertion.
How does TSM-135-04-TL-SH-A differ from the TSM-135-04-L-SH-A variant in terms of termination style?
The TSM-135-04-TL-SH-A includes tined (T) leads with a longer solder tail dimension compared to the TSM-135-04-L-SH-A. The extended tined leads improve solder joint robustness during reflow, making the TL variant preferable in applications subject to mechanical vibration or thermal cycling stress exceeding 1000 cycles from -40°C to 85°C.
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