TSM-135-04-T-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-135-04-T-DH-A-K-TR is a 70-position, 2.54 mm pitch dual-row surface mount terminal strip with tall profile option, delivering high-capacity signal routing for complex PCB interconnect designs. Tape and reel packaging enables efficient automated SMT assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- TSM-135-04-T-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-135-04-T-DH-A-K-TR?
- 70-position dual-row SMT terminal strip at 2.54 mm (0.100") pitch for high-capacity signal bus interconnection
- Tall (T) profile variant increases standoff height to accommodate mid-board component clearance in stacked PCB assemblies
- Tape and reel (TR) packaging supports automated pick-and-place SMT production for high-volume manufacturing
- Dual-row layout with 35 positions per row provides balanced mechanical retention and uniform solder joint distribution
What is TSM-135-04-T-DH-A-K-TR used for?
The TSM-135-04-T-DH-A-K-TR is ideal for backplane bus connections, multi-board embedded computing systems, and industrial control modules requiring 70-position dual-row signal routing at 2.54 mm pitch. Its tall profile suits applications where component height clearance is needed between stacked boards, such as in server blade interconnects, power distribution modules, and high-channel-count data acquisition systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-135-04-T-DH-A-K-TR datasheet?
TSM-135-04-T-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-135-04-T-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the significance of the tall profile (T) in TSM-135-04-T-DH-A-K-TR for stacked PCB designs?
The tall (T) profile provides increased mating height, typically adding 2 mm to 4 mm of clearance between boards compared to standard height variants. This accommodates taller SMT components on paired boards, making it suitable for 70-position dual-row backplane connectors in multi-layer stacked embedded systems.
How many signals can TSM-135-04-T-DH-A-K-TR route in a single connector footprint?
TSM-135-04-T-DH-A-K-TR routes 70 signals in a single dual-row SMT footprint with 35 positions per row at 2.54 mm (0.100 inch) pitch, making it one of the higher-capacity connectors in the TSM series for bus and parallel interface routing.
Which industrial or computing applications call for the 70-position capacity of TSM-135-04-T-DH-A-K-TR?
Server backplane bus connections, high-channel-count industrial I/O modules, parallel data bus interfaces, and FPGA daughter card expansions requiring 70 or more signal lines benefit from the TSM-135-04-T-DH-A-K-TR, which delivers full 70-position routing at 2.54 mm pitch in a single SMT connector.
Can TSM-135-04-T-DH-A-K-TR be used as a lower-cost alternative to a high-density 1.27 mm pitch connector in systems with relaxed space constraints?
Yes. When PCB board area is not a limiting factor and the application can tolerate a 2.54 mm pitch footprint, TSM-135-04-T-DH-A-K-TR provides 70 positions at lower per-unit cost than equivalent 1.27 mm pitch fine-pitch connectors, while still supporting standard reflow SMT assembly.
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