TSM-135-04-SM-SH-A SAMTEC Connector (Other) In Stock
SAMTEC TSM-135-04-SM-SH-A is a 35-position single-row horizontal surface-mount terminal strip with 0.100" (2.54 mm) pitch for compact SMT board-to-cable or board-to-board interconnection. Features gold-plated contacts in an SMT footprint for reflow assembly compatibility. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 35
- Lifecycle
- ACTIVE
- Datasheet
- TSM-135-04-SM-SH-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 35-position single-row horizontal SMT terminal strip at 0.100" (2.54 mm) pitch, enabling reflow-compatible assembly without through-hole drilling for efficient PCB production
- Gold-plated contacts over nickel underplate provide low stable contact resistance and corrosion protection across operating temperatures from -55°C to +125°C
- Horizontal SMT orientation reduces PCB height clearance requirements compared to vertical through-hole headers, enabling low-profile board stack designs
Applications
The TSM-135-04-SM-SH-A is designed for high-density signal and power routing in industrial automation controllers, embedded computing modules, and test and measurement equipment where 35 connections must be made in a compact SMT horizontal footprint at 0.100" pitch. Its surface-mount termination style supports standard reflow soldering at temperatures up to 260°C, reducing assembly costs by eliminating through-hole processing. The horizontal profile makes it suitable for low-profile enclosures and mezzanine board designs where vertical clearance is restricted.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch of TSM-135-04-SM-SH-A and why does the horizontal orientation benefit low-profile enclosure designs?
TSM-135-04-SM-SH-A uses a standard 0.100" (2.54 mm) pitch across 35 positions. Its horizontal surface-mount orientation keeps the connector profile parallel to the PCB surface, reducing the total board assembly height by typically 3 mm to 5 mm compared to vertical through-hole alternatives, which is critical in low-profile enclosures and tightly stacked mezzanine board assemblies.
How does SMT termination in TSM-135-04-SM-SH-A change the PCB manufacturing process compared to through-hole terminal strips?
Because TSM-135-04-SM-SH-A is surface-mount, it can be placed and soldered during standard reflow at up to 260°C alongside other SMT components without requiring a separate wave solder or hand-soldering step for through-hole pins. This reduces process steps, cuts board fabrication cost by eliminating 35 drilled holes, and enables double-sided SMT assembly on compact industrial and embedded computing boards.
For a 35-channel sensor interface in an industrial controller, when is TSM-135-04-SM-SH-A preferred over a dual-row alternative?
A single-row 35-position strip like TSM-135-04-SM-SH-A is preferred when PCB routing lanes run in one direction and the board layout cannot accommodate the wider footprint of a dual-row connector. At 0.100" pitch the 35-position strip spans approximately 88.9 mm in a single row, providing straightforward cable-to-board alignment for a 35-channel sensor harness with gold-plated contacts that maintain reliable connections across 200 or more mating cycles.
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