TSM-135-04-SM-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-135-04-SM-DH-A-P-TR is a 70-position dual-row .100" (2.54 mm) pitch surface mount terminal strip with SMT bottom-mount termination and gold-plated contacts. Provides reliable high-density signal routing for board-to-board interconnect applications in compact electronic systems. Available from global authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-135-04-SM-DH-A-P-TR?
- 70-position dual-row .100" (2.54 mm) pitch layout with 35 positions per row supports high channel-count board-to-board signal interconnects in dense PCB assemblies
- Surface mount (SM) bottom-mount termination enables automated reflow soldering, eliminating through-hole drilling and reducing PCB fabrication and assembly cost
- Gold-plated contacts with SAMTEC precision manufacturing ensure low contact resistance and long mating cycle life for reliable signal integrity across all 70 positions
What is TSM-135-04-SM-DH-A-P-TR used for?
The TSM-135-04-SM-DH-A-P-TR is suited for high-density board-to-board interconnects in server backplanes, industrial control modules, and embedded computing platforms requiring 70-pin dual-row .100" pitch connectivity with surface mount assembly. Its bottom-mount SMT termination supports automated pick-and-place manufacturing, making it a practical choice for high-volume production of signal distribution boards and mezzanine card interconnects.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-135-04-SM-DH-A-P-TR datasheet?
TSM-135-04-SM-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-135-04-SM-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the total pin count and row arrangement of the TSM-135-04-SM-DH-A-P-TR terminal strip?
The TSM-135-04-SM-DH-A-P-TR features 70 total positions arranged in 2 rows of 35 pins each at .100" (2.54 mm) pitch. This dual-row 70-pin configuration supports high signal-count board-to-board interconnect applications in telecommunications, industrial control, and embedded computing designs where large numbers of signals must cross a board-to-board interface.
How does the SMT bottom-mount style of TSM-135-04-SM-DH-A-P-TR affect PCB stack height in mezzanine designs?
The surface mount bottom-mount (SM) termination of the TSM-135-04-SM-DH-A-P-TR places the connector body directly on the PCB surface without pins extending through the board, minimizing the connector's contribution to total PCB stack height. In mezzanine card assemblies where overall height budgets are tight, this reduces the board-to-board mating height compared to through-hole alternatives while still providing 70 signal pins at 2.54 mm pitch.
For a server backplane needing 70 signal pins per connector site, how does the TSM-135-04-SM-DH-A-P-TR reduce assembly complexity?
The TSM-135-04-SM-DH-A-P-TR is compatible with standard SMT pick-and-place and reflow processes, allowing all 70 positions to be soldered simultaneously in a single reflow pass alongside other SMT components. This eliminates the manual through-hole insertion and wave soldering steps that a 70-pin DIP-style connector would require, reducing assembly time per board and supporting high-volume automated production lines for server backplane manufacturing.
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About SAMTEC
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