TSM-135-04-S-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-135-04-S-DH-A-P-TR is a 70-position dual-row 0.100" pitch surface mount terminal strip with double-height housing and solder post termination for elevated board-to-board clearance. Gold-plated contacts ensure low-resistance connections across all 70 positions. Tape-and-reel packaging enables automated SMT placement for high-volume production.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- TSM-135-04-S-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-135-04-S-DH-A-P-TR?
- 70-position dual-row configuration at 0.100" (2.54 mm) pitch accommodates wide parallel buses and mixed-signal interfaces in dense board-to-board interconnects
- Double-height (DH) housing provides elevated board clearance, allowing taller components such as capacitors or inductors to reside beneath the connector between stacked PCBs
- Tape-and-reel (TR) packaging with surface mount solder posts supports fully automated SMT assembly and high-volume production without manual insertion steps
What is TSM-135-04-S-DH-A-P-TR used for?
The TSM-135-04-S-DH-A-P-TR is designed for high-density board-to-board interconnects in embedded computing modules, industrial backplanes, and FPGA carrier boards where 70 positions at 0.100" pitch are required with extra clearance between stacked PCBs. Its double-height housing accommodates tall through-hole or SMD components mounted beneath the connector, enabling flexible component placement on both PCBs in a stacked assembly. The tape-and-reel format supports automated high-volume SMT production in telecommunications and industrial equipment manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-135-04-S-DH-A-P-TR datasheet?
TSM-135-04-S-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-135-04-S-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does TSM-135-04-S-DH-A-P-TR provide and how are they arranged?
The TSM-135-04-S-DH-A-P-TR provides 70 positions arranged in 2 rows of 35 contacts each at a 0.100" (2.54 mm) pitch. This configuration supports 35-bit parallel data buses per row or mixed signal and power allocation across both rows, making it a high-capacity interconnect solution for FPGA expansion headers, embedded processor boards, and industrial I/O modules.
What is the benefit of the double-height (DH) housing on TSM-135-04-S-DH-A-P-TR for multi-board stacked assemblies?
The double-height housing of the TSM-135-04-S-DH-A-P-TR increases the mated stack height compared to standard TSM connectors, creating a gap of approximately 8–10 mm between PCBs. This clearance accommodates tall SMD capacitors, RF shielding cans, transformers, or heat sinks that would otherwise interfere with the mating board, giving designers more freedom to place taller components on both boards in a stacked module.
Is TSM-135-04-S-DH-A-P-TR compatible with lead-free SMT reflow and RoHS directives?
Yes, SAMTEC's TSM series including the TSM-135-04-S-DH-A-P-TR is manufactured with Pb-free (RoHS-compliant) materials compatible with lead-free reflow soldering at peak temperatures up to 260°C per IPC/JEDEC J-STD-020. The tape-and-reel format ensures consistent SMT placement of all 70 positions with solder paste reflow, meeting EU RoHS 2 and global environmental compliance requirements.
When would an engineer select TSM-135-04-S-DH-A-P-TR over a lower-position TSM variant for a data acquisition board?
Engineers select the TSM-135-04-S-DH-A-P-TR when the application requires more than 64 positions at 0.100" pitch in a dual-row SMT format, such as a data acquisition board with 32 analog input channels, 16 digital I/O lines, and multiple power and ground connections spanning all 70 positions. The double-height housing is specifically valuable when the mating daughter card carries tall filter capacitors or MOSFETs that must clear the mother board surface by more than the standard connector height of approximately 4 mm.
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