TSM-135-04-LM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-135-04-LM-DH-A-K-TR is a 70-position dual-row surface mount terminal strip with 0.100 inch (2.54 mm) pitch, delivering high-density signal and power connectivity for FPGA boards, embedded computing modules, and industrial control systems.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 70-position dual-row surface mount terminal strip on a standard 0.100 inch (2.54 mm) pitch
- Dual-row arrangement provides 70 independent contacts in a compact PCB footprint
- Low-profile SMT body compatible with automated pick-and-place and reflow soldering
- LM (low-profile male) variant minimizes connector height for space-constrained designs
- RoHS compliant with broad industry mating connector compatibility at 2.54 mm pitch
Applications
The TSM-135-04-LM-DH-A-K-TR is deployed in FPGA development boards, multi-channel analog acquisition cards, and embedded Linux SOM carrier boards requiring 70 or more signal pins through a single surface mount connector. Its 0.100 inch pitch and dual-row configuration also suit backplane signal routing and expansion module interconnects in test and measurement instruments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many rows and positions per row does TSM-135-04-LM-DH-A-K-TR have on its 0.100 inch pitch layout?
TSM-135-04-LM-DH-A-K-TR has 70 pins in 2 rows of 35 contacts each, all on a 0.100 inch (2.54 mm) pitch. This dual-row arrangement provides a dense 70-pin interface within a body length of approximately 87.5 mm for high-density PCB interconnects.
Which solder reflow temperature profile is required for TSM-135-04-LM-DH-A-K-TR during SMT assembly?
SAMTEC TSM-series SMT connectors are rated for lead-free reflow at a peak of 260°C for a maximum of 30 seconds. Engineers should consult the SAMTEC TSM-135 datasheet for the precise MSL rating and pre-bake requirements to ensure reliable solder joints across all 70 pins.
Can TSM-135-04-LM-DH-A-K-TR serve as a carrier board expansion interface for a 70-GPIO system-on-module?
Yes, TSM-135-04-LM-DH-A-K-TR provides exactly 70 pins in a standard 0.100 inch dual-row footprint, making it appropriate for SOM carrier boards that need to break out GPIO, SPI, I2C, UART, and power rails from a module with 64 to 70 I/O lines in a single connector.
How does TSM-135-04-LM-DH-A-K-TR compare to a 66-position TSM-133 series connector when pin budget is the deciding factor?
TSM-135-04-LM-DH-A-K-TR provides 4 additional pins over the 66-pin TSM-133 series, which can be the deciding factor when a design needs dedicated power or ground returns alongside 66 signal lines. The 4-pin difference also extends the body length by approximately 10 mm on a 2.54 mm pitch.
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