TSM-135-04-FM-DH-A-K-TR SAMTEC Connector (Other) In Stock
TSM-135-04-FM-DH-A-K-TR is a 70-position, .100" pitch dual-row surface mount terminal strip by SAMTEC. Key specs: 35 positions per row, 2.54 mm pitch, tape-and-reel packaging for automated assembly. From $1.50, in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 70-position dual-row SMT terminal strip with 2.54 mm (.100") pitch for high-density board interconnects
- Tape-and-reel (TR) packaging enables automated pick-and-place assembly for high-volume production
- Low-profile surface mount design reduces board height while maintaining robust mechanical retention
Applications
The TSM-135-04-FM-DH-A-K-TR is ideal for high-density PCB-to-PCB interconnection in industrial control boards, data acquisition systems, and telecommunications equipment. Its 70-position dual-row layout makes it well suited for backplane connectors and card-edge interfaces where signal-dense routing is required. The tape-and-reel packaging supports automated assembly lines in volume manufacturing environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many electrical contacts does the TSM-135-04-FM-DH-A-K-TR provide in total?
The TSM-135-04-FM-DH-A-K-TR features 70 positions arranged in a dual-row configuration, providing 70 individual contacts spaced on a 2.54 mm (.100 inch) pitch. This high contact count supports dense signal routing on compact PCB layouts.
For automated SMT production lines, how is the TSM-135-04-FM-DH-A-K-TR packaged?
It comes in tape-and-reel (TR) packaging, which is compatible with standard pick-and-place equipment used in surface mount technology assembly. This format supports high-volume production runs and reduces manual handling errors, making it suitable for manufacturing environments processing thousands of boards per shift.
In what applications does the dual-row, 70-pin layout of TSM-135-04-FM-DH-A-K-TR provide a design advantage over single-row alternatives?
The 70-position dual-row arrangement on a 2.54 mm pitch allows engineers to route twice the signals in the same board footprint compared to a single-row strip. This is advantageous in backplane designs, FPGA breakout boards, and industrial I/O modules where 35+ parallel signals must connect between two PCBs in a compact assembly.
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