TSM-135-03-L-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-135-03-L-DH-A-P-TR is a 70-position single-row 2.54 mm (0.100 inch) pitch surface-mount terminal strip with dual-height low-profile design. It enables reliable board-to-board stacking in industrial and embedded applications. Available from global authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- TSM-135-03-L-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-135-03-L-DH-A-P-TR?
- 70-position single-row 2.54 mm (0.100 inch) pitch surface-mount terminal strip for high-density board-to-board connections
- Dual-height (DH) low-profile design supports multiple stack heights between mated PCBs on the same 2.54 mm pitch footprint
- Tape-and-reel (TR) packaging enables automated high-volume pick-and-place PCB assembly without manual component handling
- Surface-mount termination with through-hole tail options for robust mechanical anchoring in vibration-prone industrial environments
What is TSM-135-03-L-DH-A-P-TR used for?
The TSM-135-03-L-DH-A-P-TR is used in stackable PCB systems such as embedded computing modules, industrial I/O expansion cards, and test equipment backplanes requiring 70 positions at the 2.54 mm pitch standard. Its low-profile dual-height design accommodates components of differing heights between stacked boards, making it a preferred choice for compact system-on-module (SOM) and carrier board combinations. The tape-and-reel packaging supports seamless integration into automated SMT production lines handling hundreds of boards per shift.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-135-03-L-DH-A-P-TR datasheet?
TSM-135-03-L-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-135-03-L-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the position count and pitch specifications of the TSM-135-03-L-DH-A-P-TR?
The TSM-135-03-L-DH-A-P-TR offers 70 positions in a single row at a 2.54 mm (0.100 inch) pitch. This standard pitch ensures broad compatibility with mating connectors and established PCB grid systems used across industrial, consumer, and embedded electronics designs.
How does the dual-height (DH) feature of TSM-135-03-L-DH-A-P-TR benefit stackable PCB designs?
The dual-height designation means the TSM-135-03-L-DH-A-P-TR supports two board-separation distances within the same 2.54 mm pitch connector family. This flexibility allows hardware engineers to choose a stack height that accommodates tall components — such as capacitors or heat sinks up to 8.5 mm — between the two mated PCBs without changing the connector footprint.
Is the TSM-135-03-L-DH-A-P-TR compatible with automated SMT assembly lines?
Yes, the -TR suffix indicates tape-and-reel packaging that is fully compatible with industry-standard pick-and-place machines operating at standard component feed rates. The surface-mount termination style allows reflow soldering at lead-free peak temperatures up to 260°C, making it suitable for high-volume automated PCB assembly of 70-position board-to-board connectors.
What embedded or industrial applications commonly use the TSM-135-03-L-DH-A-P-TR?
TSM-135-03-L-DH-A-P-TR is frequently specified in system-on-module carrier boards, PLC expansion racks, data acquisition systems, and ruggedized embedded computing platforms where a 70-position 2.54 mm pitch stacking connector with low-profile dual-height clearance is needed across an operating temperature range of -55°C to +125°C.
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