TSM-135-03-H-DH-A-P-TR SAMTEC Connector (Other) In Stock
TSM-135-03-H-DH-A-P-TR is a SAMTEC 70-position dual-row surface-mount terminal strip on 2.54 mm (0.100 inch) pitch in tape-and-reel packaging for automated assembly. Provides high pin-count board-to-board or wire-to-board connectivity in a compact SMT footprint. Available for immediate shipment with worldwide delivery.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- TSM-135-03-H-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-135-03-H-DH-A-P-TR?
- 70 positions on 2.54 mm (0.100 inch) pitch in a dual-row SMT layout delivers high-density interconnect without through-hole drilling
- Tape-and-reel (-TR) packaging enables automated pick-and-place assembly at production volumes, reducing hand-loading costs for large pin-count connectors
- SAMTEC TSM series dual-header design supports both vertical and angled mating configurations for flexible PCB stack orientation
What is TSM-135-03-H-DH-A-P-TR used for?
TSM-135-03-H-DH-A-P-TR is used in backplane expansion headers, FPGA breakout boards, and multi-channel data acquisition modules where 70 signals must cross a board-to-board or wire-to-board boundary in a single connector footprint. Its SMT termination and tape-and-reel packaging support high-volume automated assembly in telecom line cards, industrial controller motherboards, and test fixture interface boards. Development and prototyping platforms also use it as a high-density GPIO expansion header compatible with standard 2.54 mm pitch ribbon cables.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-135-03-H-DH-A-P-TR datasheet?
TSM-135-03-H-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-135-03-H-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does TSM-135-03-H-DH-A-P-TR provide, and how are they arranged?
TSM-135-03-H-DH-A-P-TR carries 70 total positions arranged in a dual-row (2 rows × 35) layout on 2.54 mm (0.100 inch) row pitch. The dual-row format concentrates 70 signals into roughly 89 mm of board length, making it one of the most compact SMT options for routing 70 independent signals across a backplane or mother-daughter card interface.
What assembly method does TSM-135-03-H-DH-A-P-TR support, and does the packaging suit production lines?
TSM-135-03-H-DH-A-P-TR is a surface-mount component supplied in tape-and-reel (-TR) packaging, which is directly compatible with standard IPC-7711 pick-and-place equipment. Tape-and-reel presentation enables continuous automated placement at speeds of 3,000 to 8,000 placements per hour on modern SMT lines, eliminating the hand-loading step required for bulk-packed or tray-packed high pin-count connectors in production environments.
Which expansion or backplane applications benefit most from the TSM-135-03-H-DH-A-P-TR's 70-pin count?
FPGA evaluation kits, SoC breakout boards, and industrial backplane systems benefit most from a 70-pin dual-row 2.54 mm SMT header. A 70-position connector can carry 32 data bits plus control, power, and ground signals simultaneously, supporting parallel bus interfaces up to 32 bits wide alongside 8 GPIO and 8 power or ground pins without requiring a second connector. This single-connector approach reduces PCB routing complexity compared to using multiple 20-pin or 34-pin connectors.
How does TSM-135-03-H-DH-A-P-TR compare to through-hole equivalents for mechanical retention?
The SMT termination of TSM-135-03-H-DH-A-P-TR relies on solder joint shear strength rather than through-hole press-fit or wave-solder anchor force. Standard SMT solder joints on a 70-position connector provide adequate retention for static or low-vibration environments, but for applications exceeding 5 G vibration or frequent mating cycles above 200 times, a through-hole or press-fit dual-row header on 2.54 mm pitch offers 3–5 times higher pull-out force than an equivalent SMT connection.
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