TSM-135-03-H-DH-A-P-TR SAMTEC Connector (Other) In Stock

TSM-135-03-H-DH-A-P-TR is a SAMTEC 70-position dual-row surface-mount terminal strip on 2.54 mm (0.100 inch) pitch in tape-and-reel packaging for automated assembly. Provides high pin-count board-to-board or wire-to-board connectivity in a compact SMT footprint. Available for immediate shipment with worldwide delivery.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TSM-135-03-H-DH-A-P-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
70
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of TSM-135-03-H-DH-A-P-TR?

  • 70 positions on 2.54 mm (0.100 inch) pitch in a dual-row SMT layout delivers high-density interconnect without through-hole drilling
  • Tape-and-reel (-TR) packaging enables automated pick-and-place assembly at production volumes, reducing hand-loading costs for large pin-count connectors
  • SAMTEC TSM series dual-header design supports both vertical and angled mating configurations for flexible PCB stack orientation

What is TSM-135-03-H-DH-A-P-TR used for?

TSM-135-03-H-DH-A-P-TR is used in backplane expansion headers, FPGA breakout boards, and multi-channel data acquisition modules where 70 signals must cross a board-to-board or wire-to-board boundary in a single connector footprint. Its SMT termination and tape-and-reel packaging support high-volume automated assembly in telecom line cards, industrial controller motherboards, and test fixture interface boards. Development and prototyping platforms also use it as a high-density GPIO expansion header compatible with standard 2.54 mm pitch ribbon cables.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Where can I find the TSM-135-03-H-DH-A-P-TR datasheet?

TSM-135-03-H-DH-A-P-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for TSM-135-03-H-DH-A-P-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many signal positions does TSM-135-03-H-DH-A-P-TR provide, and how are they arranged?

TSM-135-03-H-DH-A-P-TR carries 70 total positions arranged in a dual-row (2 rows × 35) layout on 2.54 mm (0.100 inch) row pitch. The dual-row format concentrates 70 signals into roughly 89 mm of board length, making it one of the most compact SMT options for routing 70 independent signals across a backplane or mother-daughter card interface.

What assembly method does TSM-135-03-H-DH-A-P-TR support, and does the packaging suit production lines?

TSM-135-03-H-DH-A-P-TR is a surface-mount component supplied in tape-and-reel (-TR) packaging, which is directly compatible with standard IPC-7711 pick-and-place equipment. Tape-and-reel presentation enables continuous automated placement at speeds of 3,000 to 8,000 placements per hour on modern SMT lines, eliminating the hand-loading step required for bulk-packed or tray-packed high pin-count connectors in production environments.

Which expansion or backplane applications benefit most from the TSM-135-03-H-DH-A-P-TR's 70-pin count?

FPGA evaluation kits, SoC breakout boards, and industrial backplane systems benefit most from a 70-pin dual-row 2.54 mm SMT header. A 70-position connector can carry 32 data bits plus control, power, and ground signals simultaneously, supporting parallel bus interfaces up to 32 bits wide alongside 8 GPIO and 8 power or ground pins without requiring a second connector. This single-connector approach reduces PCB routing complexity compared to using multiple 20-pin or 34-pin connectors.

How does TSM-135-03-H-DH-A-P-TR compare to through-hole equivalents for mechanical retention?

The SMT termination of TSM-135-03-H-DH-A-P-TR relies on solder joint shear strength rather than through-hole press-fit or wave-solder anchor force. Standard SMT solder joints on a 70-position connector provide adequate retention for static or low-vibration environments, but for applications exceeding 5 G vibration or frequent mating cycles above 200 times, a through-hole or press-fit dual-row header on 2.54 mm pitch offers 3–5 times higher pull-out force than an equivalent SMT connection.

Related Guides

Why Buy from FindMyChip

Authorized Source
Verified supply chain with full traceability & inspection
Competitive Pricing
Factory-direct from China distributors, low MOQ
Fast Shipping
DHL Express 3–5 days · FedEx/UPS 5–7 days worldwide
Quality Guaranteed
30-day replacement for defective parts, no questions asked

About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
Buy from 1pc · Factory-direct pricing
pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Response time is incredible — usually under 4 hours. They understand that production lines can't wait.

JW
James Wright
Supply Chain Director, CircuitPro Ltd, UK