TSM-135-02-SS-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-135-02-SS-DH-A-P-TR is a 70-position surface mount terminal strip with 0.100" (2.54 mm) pitch and dual-row design for high-density board-level interconnections. Tape-and-reel packaging and RoHS compliance support automated SMT production in industrial and embedded computing designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-135-02-SS-DH-A-P-TR?
- 70-position dual-row surface mount terminal strip at 0.100" (2.54 mm) pitch delivers high-density signal and power routing in a single connector
- Tape-and-reel (TR) packaging enables automated pick-and-place SMT assembly for high-volume, cost-efficient manufacturing
- RoHS-compliant design with selective solder-compatible contacts ensures compatibility with modern lead-free production processes
What is TSM-135-02-SS-DH-A-P-TR used for?
The TSM-135-02-SS-DH-A-P-TR is suited for high-density board-to-board interconnect applications in embedded computing platforms, telecommunications line cards, and industrial backplane systems requiring 70 parallel signal connections at 2.54 mm pitch. Its dual-row SMT configuration and tape-and-reel format support automated assembly in volume production environments, making it appropriate for server daughtercards, FPGA carrier boards, and multi-channel data acquisition modules.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-135-02-SS-DH-A-P-TR datasheet?
TSM-135-02-SS-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-135-02-SS-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 70-position dual-row layout of TSM-135-02-SS-DH-A-P-TR benefit high-density FPGA carrier board designs?
With 70 positions arranged in 2 rows at 0.100 inch (2.54 mm) pitch, the TSM-135-02-SS-DH-A-P-TR provides 70 simultaneous signal connections in a single compact footprint. For FPGA carrier boards with wide data buses, this eliminates multiple connectors, reduces routing complexity, and keeps the 35-pin-per-row layout accessible to standard 2.54 mm female mating headers.
What is the pitch of TSM-135-02-SS-DH-A-P-TR and why does it matter for mating connector selection?
The TSM-135-02-SS-DH-A-P-TR uses 0.100 inch (2.54 mm) pitch, the most widely standardized connector pitch in the electronics industry. This ensures compatibility with thousands of available mating female headers, IDC ribbon cable connectors, and board-to-board sockets from multiple vendors, reducing procurement risk and enabling flexible cabling strategies across embedded and industrial system designs.
When is TSM-135-02-SS-DH-A-P-TR a better procurement choice than ordering multiple 20-position Samtec TSM connectors?
When a design requires 70 signals at 2.54 mm pitch, a single TSM-135-02-SS-DH-A-P-TR simplifies bill-of-materials management by replacing three or more smaller connectors. This reduces the number of distinct part numbers to stock, minimizes PCB footprint gaps between connectors, and cuts assembly time and potential alignment errors compared to placing multiple 20-position or 24-position connectors side by side.
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