TSM-135-02-LM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-135-02-LM-DH-A-K-TR is a 70-position dual-row surface-mount terminal strip with 0.100" (2.54 mm) pitch, offered in tape-and-reel packaging for automated SMT placement, providing reliable PCB signal distribution in industrial and embedded computing interconnect designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 70 positions dual-row surface-mount terminal strip on 0.100" (2.54 mm) pitch grid
- Tape-and-reel (TR) packaging for high-volume automated pick-and-place SMT assembly
- Dual-row (DH) configuration doubles contact density versus single-row headers
- Surface-mount termination style enabling reflow solder attachment without through-hole drilling
- SAMTEC active product with global distribution for design-in and volume procurement
Applications
The TSM-135-02-LM-DH-A-K-TR is used in embedded computing motherboards, industrial control backplanes, and test-and-measurement PCBs where 70 SMT signal lines must be accessed via a standard 0.100" pitch dual-row header. Its tape-and-reel format makes it particularly suited for high-volume production lines using automated SMT pick-and-place equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Why does TSM-135-02-LM-DH-A-K-TR come in tape-and-reel packaging, and what assembly advantage does that provide?
The -TR suffix indicates tape-and-reel packaging, which allows automated pick-and-place machines to handle the connector at standard SMT placement speeds. This reduces per-unit handling time significantly compared with tray or tube packaging, and it supports zero-defect oriented assembly processes for boards requiring 70-pin connector placement at high volume.
How does the dual-row (DH) 0.100" pitch layout of TSM-135-02-LM-DH-A-K-TR influence PCB routing compared with a single-row 70-pin alternative?
A dual-row layout at 0.100" pitch places 70 contacts in two parallel rows, making the connector body roughly 35 positions long (approximately 3.4 inches) instead of 70 positions (about 6.9 inches) for a single-row version. This shorter footprint frees PCB edge space and simplifies breakout routing to a 100-mil grid.
What connector family should engineers evaluate when looking for a mating plug to pair with TSM-135-02-LM-DH-A-K-TR?
SAMTEC's TSM series is engineered to mate with corresponding TSW or SSW through-hole or surface-mount socket headers on 0.100" pitch. For board-to-board stacking configurations with 70 positions, designers should verify stack height and mating force requirements against SAMTEC's published 2.54 mm pitch mating interface data, typically supporting mating cycles of at least 30 cycles.
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