TSM-135-02-H-DH-A-P-TR SAMTEC Connector (Other) In Stock
Samtec TSM-135-02-H-DH-A-P-TR is a 70-position dual-row surface-mount terminal strip with 2.54mm (0.100 inch) pitch, featuring a high-profile (H) stack height for increased board-to-board clearance. Tape-and-reel packaging supports automated SMT assembly. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- TSM-135-02-H-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-135-02-H-DH-A-P-TR?
- 70 positions in dual-row configuration at 2.54mm pitch for high-density SMT board-to-board connections
- High-profile (H) stack height provides additional clearance for daughter-card components above the host board
- Tape-and-reel (TR) packaging supports automated pick-and-place production at high volume
- Industry-standard 0.100-inch (2.54mm) pitch ensures compatibility with a broad range of mating connectors
- SMT termination eliminates through-hole processing, simplifying PCB fabrication and reducing layer count constraints
What is TSM-135-02-H-DH-A-P-TR used for?
The TSM-135-02-H-DH-A-P-TR is used in daughter-card and mezzanine board interconnects where the high-profile stack height allows tall components to clear the host PCB surface. With 70 contacts at 2.54mm pitch, it suits industrial I/O expansion cards, FPGA mezzanine modules, and embedded computing carrier boards requiring dense signal routing. The tape-and-reel format enables efficient automated assembly for medium-to-high volume production runs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-135-02-H-DH-A-P-TR datasheet?
TSM-135-02-H-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-135-02-H-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the TSM-135-02-H-DH-A-P-TR provide, and at what pitch?
The TSM-135-02-H-DH-A-P-TR provides 70 positions arranged in 2 rows of 35 contacts at 2.54mm (0.100 inch) pitch. The dual-row layout maximizes contact density per unit board length, making it practical for connecting daughter cards or mezzanine modules that require large numbers of signal, ground, and power pins.
What does the H (high-profile) designation mean for the TSM-135-02-H-DH-A-P-TR stack height?
The H suffix indicates a high-profile mating height, which provides greater vertical clearance between the host and daughter boards compared to standard or low-profile TSM variants. This extra clearance — typically several additional millimeters — is necessary when the daughter card carries tall components such as inductors, large capacitors, or heat sinks that must not contact the host board.
Can TSM-135-02-H-DH-A-P-TR be used in automated SMT production lines?
Yes. The TR (tape-and-reel) packaging of the TSM-135-02-H-DH-A-P-TR is designed for pick-and-place machines, enabling placement of 70-pin SMT connectors at high throughput on standard SMT assembly lines. The surface-mount termination also eliminates the need for wave soldering, simplifying the reflow-only assembly process.
Which Samtec mating connectors are compatible with the TSM-135-02-H-DH-A-P-TR?
Samtec SSW, TSW, and equivalent 2.54mm dual-row socket connectors are the primary mating partners for the TSM-135-02-H-DH-A-P-TR. Designers should select the mating socket with a pin insertion depth and retention specification that matches the H-profile standoff height to ensure correct board-to-board engagement and mechanical stability.
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