TSM-135-02-F-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-135-02-F-DH-A-K-TR is a 70-position, dual-row surface mount terminal strip on 0.100 inch pitch with dual-height pin design for versatile board-to-board or wire-to-board connections. Tape-and-reel packaging enables automated SMT assembly at high volumes. Available in stock worldwide with fast delivery.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- TSM-135-02-F-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-135-02-F-DH-A-K-TR?
- 70-position dual-row (35 per row) layout on 0.100 inch pitch delivers high-density signal routing in a standard 2.54 mm footprint
- Dual-height (DH) pin design supports simultaneous top-side and bottom-side PCB mating from a single surface mount location
- Tape-and-reel (TR) packaging enables automated high-volume pick-and-place SMT assembly for production efficiency
What is TSM-135-02-F-DH-A-K-TR used for?
TSM-135-02-F-DH-A-K-TR is used in server backplanes, industrial control boards, and embedded module stacking applications where 70 signals must be routed between PCB layers or daughter cards. The dual-height pin design allows connection to headers on both PCB sides without adding a second connector, reducing BOM complexity. Its standard 0.100 inch pitch and tape-and-reel format make it compatible with automated SMT lines in high-volume manufacturing environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-135-02-F-DH-A-K-TR datasheet?
TSM-135-02-F-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-135-02-F-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does TSM-135-02-F-DH-A-K-TR provide, and how are they arranged across rows?
TSM-135-02-F-DH-A-K-TR provides 70 total positions arranged in 2 rows of 35 contacts each, on a 0.100 inch (2.54 mm) pitch. This dual-row layout enables high-density signal routing for applications requiring 70 independent channels on a compact PCB footprint.
What advantage does the dual-height pin design offer in a board stacking application using TSM-135-02-F-DH-A-K-TR?
The dual-height (DH) configuration extends pins both above and below the PCB surface from a single surface mount body, allowing the connector to interface with mating sockets or headers on both the top and bottom of the board simultaneously. This is valuable in 70-signal sandwich-stack designs where minimizing Z-height and connector count is a priority.
For a production PCB line, how does TSM-135-02-F-DH-A-K-TR's packaging format support automated assembly?
The TR (tape-and-reel) packaging format allows TSM-135-02-F-DH-A-K-TR to be fed directly into automated pick-and-place SMT equipment without manual handling. This eliminates placement errors in 70-position connectors, reduces cycle time, and is compatible with standard reel-fed assembly lines running at high throughput volumes.
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