TSM-135-01-LM-DH-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-135-01-LM-DH-P-TR is a dual-row 70-position surface mount terminal strip on a 0.100-inch pitch, featuring gold-plated contacts and tape-and-reel packaging for automated SMT assembly. From $3.00 in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- TSM-135-01-LM-DH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-135-01-LM-DH-P-TR?
- 70-position dual-row SMT terminal strip on 0.100-inch pitch for dense signal routing
- Gold-plated contact finish ensures low insertion loss and long-term corrosion resistance
- Tape-and-reel (TR) packaging supports high-volume automated pick-and-place assembly
What is TSM-135-01-LM-DH-P-TR used for?
The TSM-135-01-LM-DH-P-TR serves as a high-density signal interface in backplane systems, embedded computing modules, and FPGA daughter-card interconnects requiring 70 signal paths in a compact surface-mount footprint. Its dual-row 0.100-inch pitch layout is compatible with standard PCB grid systems, making it straightforward to integrate into existing designs. Tape-and-reel delivery enables seamless insertion into SMT production lines without manual loading.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-135-01-LM-DH-P-TR datasheet?
TSM-135-01-LM-DH-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-135-01-LM-DH-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal contacts does TSM-135-01-LM-DH-P-TR provide and at what pitch?
The TSM-135-01-LM-DH-P-TR provides 70 positions arranged in a dual-row configuration on a 0.100-inch (2.54mm) pitch, supporting dense multi-signal interfaces on standard PCB grid layouts without custom footprint design.
For a compact FPGA evaluation board, why choose the surface-mount TSM-135 over a through-hole variant?
Surface-mount assembly allows the TSM-135-01-LM-DH-P-TR to be placed by automated pick-and-place machines, reducing assembly labor cost and enabling lower-profile board stacking compared to through-hole pins that protrude through the PCB.
Does the tape-and-reel packaging simplify procurement for a production run of 10,000 boards?
Yes. Tape-and-reel packaging means the TSM-135-01-LM-DH-P-TR feeds directly into SMT machines without manual component loading, improving throughput and reducing handling errors across large production runs of thousands of units.
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