TSM-135-01-L-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-135-01-L-DH-A-K-TR is a 70-position single-row surface-mount terminal strip with 0.100" pitch, featuring low-profile design and dual-height board stacking capability in tape-and-reel packaging for automated assembly. Available in stock worldwide.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- TSM-135-01-L-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 70-position single-row SMT terminal strip at 0.100" pitch enables straightforward board-to-board signal routing with minimal width overhead
- Low-profile (L) and dual-height (DH) construction provides precise controlled board-to-board spacing in compact stacked PCB assemblies
- Tape-and-reel (TR) packaging supports high-volume automated pick-and-place manufacturing with consistent placement accuracy
Applications
The TSM-135-01-L-DH-A-K-TR serves as a single-row 70-pin SMT interconnect in embedded computing modules, industrial control systems, and test equipment where 0.100" pitch terminal strips are needed for reliable board-to-board signal routing. Its low-profile and dual-height design accommodates stacked PCB configurations in enclosures with constrained vertical clearance.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does TSM-135-01-L-DH-A-K-TR provide and in what row configuration?
The TSM-135-01-L-DH-A-K-TR provides 70 positions in a single-row configuration at a 0.100" (2.54 mm) pitch. The single-row layout results in a connector body approximately 6.9 inches long, making it suitable for boards where signals must be distributed along one edge with standard 0.100" pitch spacing.
What advantage does the low-profile (L) variant of TSM-135-01-L-DH-A-K-TR offer compared to standard-height models?
The low-profile designation reduces the connector's standoff height above the PCB surface, which is critical when two boards must be stacked within a tight enclosure. For 70-position board-to-board interconnects, the low-profile design allows board stacking heights as low as 4 mm or less, compared to 8 mm or more for standard dual-height variants.
Is TSM-135-01-L-DH-A-K-TR compatible with automated assembly and what packaging does it use?
Yes, the TR suffix designates tape-and-reel packaging, making the TSM-135-01-L-DH-A-K-TR fully compatible with automated SMT pick-and-place assembly. The 70-position strip is loaded onto standard reels for high-volume production runs, eliminating manual placement of individual connectors and reducing assembly cycle time.
When would TSM-135-01-L-DH-A-K-TR be preferred over a dual-row TSM connector with 70 positions?
The single-row TSM-135-01-L-DH-A-K-TR at 0.100" pitch is preferred when board space along one axis is available and a single-edge connector is simpler to route on the PCB. A dual-row alternative with 70 positions would be half the physical length but doubles the width, which may conflict with nearby components. The single-row approach also simplifies signal assignment across all 70 positions.
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