TSM-135-01-H-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-135-01-H-DH-A-K-TR is a 70-position dual-row surface-mount terminal strip with 2.54 mm (0.100") pitch and high-profile design, providing robust high-density board interconnection for computing modules, backplane systems, and industrial controllers.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- TSM-135-01-H-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 70 positions (35 per row) dual-row layout for maximum signal density per connector
- 2.54 mm (0.100 inch) pitch for compatibility with standard PCB grid systems
- High-profile (H) design accommodates taller PCB-to-board mating requirements
- Gold-plated (A) contacts deliver low contact resistance and extended mating cycle life
- Tape-and-reel (TR) packaging enables high-throughput automated SMT assembly
Applications
TSM-135-01-H-DH-A-K-TR is used in FPGA mezzanine board interconnects, backplane expansion slot connectors, and high-density daughter card interfaces where 70 signal positions must be reliably routed via a surface-mount footprint. The high-profile variant provides additional clearance between boards, making it well suited for assemblies where a heat sink, cable bundle, or component overhang requires extra vertical spacing above the PCB surface.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the high-profile variant of TSM-135-01-H-DH-A-K-TR benefit assemblies with tall components on the mating board?
The -H (high-profile) designation in TSM-135-01-H-DH-A-K-TR increases the stand-off height above the PCB compared to standard-profile versions. This extra clearance — typically several millimeters — allows tall electrolytic capacitors, heat sinks, or cable connectors on the mating board to clear the PCB surface without interfering with the 70-position connector body.
For a 64-lane PCIe-style expansion bus, does 70 positions provide enough capacity for data, power, and sideband signals?
TSM-135-01-H-DH-A-K-TR provides 70 total contacts across 2 rows of 35. For a 64-lane bus requiring 64 signal, 4 power, and 2 ground contacts, 70 positions is barely sufficient. Designers can allocate 64 data lanes plus 4 power and 2 ground lines within the 70 available contacts, though a wider connector may be preferred for designs also requiring multiple reference or clock signals.
When sourcing TSM-135-01-H-DH-A-K-TR for a production run of 2000 boards, what lead time should procurement plan for?
SAMTEC TSM series connectors in tape-and-reel format typically carry a factory lead time of 8 to 14 weeks for high-position-count variants. For a 2000-board production run of a 70-position connector, procurement teams should place orders at least 16 weeks in advance to account for manufacturing lead time plus inbound freight, and should confirm reel quantities — often 500 or 1000 pieces per reel — to ensure material availability aligns with production scheduling.
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