TSM-135-01-FM-SH-A SAMTEC Connector (Other) In Stock
SAMTEC TSM-135-01-FM-SH-A is a 70-position dual-row surface mount terminal strip with 0.100 inch (2.54 mm) pitch in a horizontal orientation for high-density SMT board interconnects. It features a shrouded housing for polarized mating and protection of contacts during assembly. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 35
- Lifecycle
- ACTIVE
- Datasheet
- TSM-135-01-FM-SH-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-135-01-FM-SH-A?
- 70-position (35 per row) dual-row surface mount terminal strip with 0.100 inch (2.54 mm) pitch for high signal-count SMT designs
- Shrouded housing provides polarized mating guidance and contact protection, reducing mis-mating risk in production environments
- Horizontal SMT termination supports reflow soldering processes, enabling integration into automated PCB assembly lines
What is TSM-135-01-FM-SH-A used for?
The TSM-135-01-FM-SH-A is suited for high-density board-to-board and wire-to-board interconnects in industrial controllers, embedded computing platforms, and test and measurement modules. Its 70-position dual-row layout at 0.100 inch pitch enables complex signal routing across backplanes and mezzanine boards in compact form factors. The shrouded housing makes it particularly valuable in systems requiring reliable polarized mating to prevent assembly errors.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-135-01-FM-SH-A datasheet?
TSM-135-01-FM-SH-A Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-135-01-FM-SH-A?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the shrouded housing of the TSM-135-01-FM-SH-A improve connector reliability over an unshrouded alternative?
The shrouded housing of TSM-135-01-FM-SH-A provides a polarized guide that aligns the mating connector to the correct 70-position, 0.100 inch pitch orientation, preventing reverse or offset mating. This is critical in industrial automation and embedded computing where incorrect connections could damage boards or disrupt system operation.
Which surface mount board applications benefit most from the dual-row 70-position layout of the TSM-135-01-FM-SH-A?
The 70-position dual-row SMT layout is especially valuable in FPGA carrier boards, backplane interconnects, and modular I/O systems where many parallel signal lines must be routed between boards on a 0.100 inch (2.54 mm) pitch. Embedded computing and test equipment platforms commonly use this type of terminal strip.
Can the TSM-135-01-FM-SH-A be used with standard reflow soldering, and what assembly process does it support?
Yes, the TSM-135-01-FM-SH-A is designed as a surface mount component that supports standard reflow soldering at typical PCB assembly temperatures. The horizontal SMT footprint at 0.100 inch pitch is compatible with automated pick-and-place and solder paste printing processes used in medium- to high-volume PCB production.
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