TSM-134-03-LM-DH-A-K-TR SAMTEC Connector (Other) In Stock
Samtec TSM-134-03-LM-DH-A-K-TR is a 68-position dual-row surface mount terminal strip with 2.54 mm (0.100 inch) pitch and low-profile LM configuration. Features gold-plated contacts, friction-lock A-type housing, and tape-and-reel SMT packaging for high-volume automated assembly. Ideal for high pin-count board-to-board interconnect in embedded and industrial computing designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 68
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-134-03-LM-DH-A-K-TR?
- 68-position dual-row layout at 2.54 mm pitch providing 34 contacts per row for high pin-count board interconnect
- Low-profile LM configuration reducing connector height above the PCB surface in space-constrained assemblies
- Friction-lock A-type housing ensuring positive mechanical retention of mated connectors without additional hardware
- Gold-plated mating contacts delivering low and stable contact resistance across all 68 positions
- Tape-and-reel SMT packaging enabling high-speed automated pick-and-place assembly for volume production
What is TSM-134-03-LM-DH-A-K-TR used for?
The TSM-134-03-LM-DH-A-K-TR is designed for high pin-count board-to-board and mezzanine interconnect applications in industrial computing, FPGA development boards, and embedded control systems. Its 68-position dual-row 2.54 mm pitch configuration provides an efficient interface for expansion daughter cards, backplane connectors, and modular I/O systems where large numbers of signal and power connections must be routed through a single compact connector footprint.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-134-03-LM-DH-A-K-TR datasheet?
TSM-134-03-LM-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-134-03-LM-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many total contact positions does TSM-134-03-LM-DH-A-K-TR provide and how does the dual-row layout benefit PCB routing?
TSM-134-03-LM-DH-A-K-TR provides 68 contact positions arranged in a dual-row (DH) format at 2.54 mm pitch, with 34 contacts per row. This dual-row arrangement halves the board edge length required compared to a single-row connector of the same 68-pin count, allowing more efficient PCB area use in expansion headers, mezzanine card interfaces, and backplane daughter board designs.
What does the LM low-profile designation on TSM-134-03-LM-DH-A-K-TR mean for board stacking clearance?
The LM designation specifies a low-profile mating height, which reduces the vertical clearance required between stacked PCBs or within an enclosure. In applications where component height above the board is tightly constrained, such as compact embedded modules or slim industrial controllers, the low-profile LM configuration helps maintain the 2.54 mm pitch contact layout while minimizing the overall stacked assembly height.
How does the friction-lock A-type housing on TSM-134-03-LM-DH-A-K-TR prevent connector unmating in vibrating environments?
The A-type friction-lock housing generates a compressive retention force against the mating connector body, resisting accidental withdrawal without requiring latches or screws. Across 68 positions, the cumulative normal force from all contact wiping areas contributes to mechanical retention, making TSM-134-03-LM-DH-A-K-TR suitable for industrial equipment and embedded systems subject to low-frequency vibration or mechanical shock during operation.
Which production assembly considerations apply when placing TSM-134-03-LM-DH-A-K-TR on an SMT line?
The TR (tape-and-reel) suffix means the connector ships in reel format for automated pick-and-place assembly. With 68 contact positions, the connector body is relatively long on the PCB, so the SMT line must correctly orient the part and verify the solder paste deposit covers all 68 pads uniformly. Engineers should confirm the reflow profile is compatible with the connector's housing material to avoid warpage or solder bridging across adjacent pads.
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