TSM-134-03-L-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-134-03-L-DH-A-K-TR is a 68-position dual-row surface-mount terminal strip with 2.54 mm (0.100") pitch and low-profile design, offering reliable high-density board interconnection for industrial, computing, and instrumentation applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 68
- Lifecycle
- ACTIVE
- Datasheet
- TSM-134-03-L-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-134-03-L-DH-A-K-TR?
- 68 positions (34 per row) dual-row layout for high-density signal distribution
- 2.54 mm (0.100 inch) standard pitch for universal PCB grid compatibility
- Low-profile (L) design minimizes connector height above the PCB surface
- Surface-mount termination enables automated SMT reflow assembly
- Tape-and-reel (TR) packaging supports high-volume pick-and-place manufacturing
What is TSM-134-03-L-DH-A-K-TR used for?
TSM-134-03-L-DH-A-K-TR is designed for mezzanine board connections, FPGA I/O expansion, and backplane signal distribution in embedded computing and industrial control systems. The 68-position low-profile dual-row format makes it especially effective in height-constrained enclosures and multi-board stack assemblies where 68 signal lanes must be reliably routed in a minimal board footprint.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-134-03-L-DH-A-K-TR datasheet?
TSM-134-03-L-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-134-03-L-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the low-profile variant of TSM-134-03-L-DH-A-K-TR benefit a height-restricted multi-board stack?
The -L (low-profile) designation in TSM-134-03-L-DH-A-K-TR results in a reduced mated height compared to standard-profile TSM connectors. In a multi-board stack where vertical clearance is limited to less than 10 mm, the lower profile preserves board-to-board gap for airflow while still delivering all 68 signal positions reliably.
For an FPGA carrier board needing 60+ I/O lanes, does the 68-position count of TSM-134-03-L-DH-A-K-TR provide sufficient capacity?
Yes. TSM-134-03-L-DH-A-K-TR offers 68 total contacts arranged in 2 rows of 34, providing 68 lanes for FPGA GPIO, differential pairs, power, and ground. This is sufficient for typical mid-range FPGA daughter card interfaces that require between 48 and 72 signal pins.
When sourcing TSM-134-03-L-DH-A-K-TR in tape-and-reel for a production run, what reel quantity should procurement teams expect?
SAMTEC tape-and-reel connectors in the TSM series are typically packed in reels of 500 or 1000 units per reel depending on connector size. For a 68-position TSM, procurement teams should confirm the exact reel count per SAMTEC's standard packaging specification and plan for a 12-week factory lead time for large orders.
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