TSM-134-03-H-DH-A-P-TR SAMTEC Connector (Other) In Stock
Samtec TSM-134-03-H-DH-A-P-TR is a 68-position, 2.54 mm (0.100 inch) pitch triple-row high-profile surface-mount terminal strip with dual-height housing and tape-and-reel packaging for robust board-to-board signal and power distribution.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 68
- Lifecycle
- ACTIVE
- Datasheet
- TSM-134-03-H-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-134-03-H-DH-A-P-TR?
- 68-position triple-row configuration at 2.54 mm (0.100 inch) pitch enables high-density signal and power routing across board-to-board interfaces
- High-profile (H) dual-height (DH) housing supports larger board separation distances, accommodating components taller than 5 mm on mated PCBs
- Tape-and-reel (TR) packaging enables automated SMT placement at high throughput, reducing assembly time and lowering per-unit cost in volume production
What is TSM-134-03-H-DH-A-P-TR used for?
The TSM-134-03-H-DH-A-P-TR is suited for high-density board stacking in data acquisition systems, industrial PLCs, and communication backplanes requiring 68 positions in a compact 0.100 inch pitch triple-row format. The high-profile dual-height housing allows mated boards to clear through-hole or tall SMD components, making it a practical choice in mixed-technology assemblies. Its surface-mount footprint with tape-and-reel packaging integrates directly into automated reflow lines without additional fixturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-134-03-H-DH-A-P-TR datasheet?
TSM-134-03-H-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-134-03-H-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What position count and row arrangement does TSM-134-03-H-DH-A-P-TR offer for high-density designs?
The TSM-134-03-H-DH-A-P-TR provides 68 positions across 3 rows at a 2.54 mm (0.100 inch) pitch, giving an interconnect density that supports parallel data buses, mixed signal, and auxiliary power rails within a single connector footprint on surface-mount PCBs.
How does the high-profile (H) designation affect board separation in a stacked assembly?
The high-profile designation extends the housing height, enabling board-to-board separation distances typically ranging from 10 mm to 20 mm. This additional clearance accommodates components or heat sinks taller than 5 mm on either mated board, which is especially valuable in industrial and telecom chassis where mixed-height component populations are common.
Is TSM-134-03-H-DH-A-P-TR a direct alternative to TSM-134-03-SM-DH-A-P-TR for low-profile stacking applications?
The TSM-134-03-H-DH-A-P-TR differs from SM (standard-profile) variants in mating height, typically adding 4 mm to 8 mm of additional clearance above the PCB surface. Where board separation must remain below 10 mm and component height is constrained, the standard-profile SM version is preferred; for assemblies needing 10 mm or more of clearance, the H variant provides the necessary standoff while retaining the same 68-position, 2.54 mm pitch footprint.
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