TSM-134-02-TM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-134-02-TM-DH-A-K-TR is a 68-position dual-row surface mount terminal strip at 0.100" pitch with mid-height TM body, through-hole clinch mounting, and tape-and-reel packaging for automated high-density PCB interconnect assembly. Globally in stock.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 68
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 68-position dual-row (2x34) configuration at 0.100 inch pitch provides 34 columns of SMD contacts for demanding board-to-board signal interconnect applications
- Mid-height TM body style balances board clearance and stacking height requirements, offering an intermediate profile between standard and low-profile dual-height TSM variants
- Clinch-through mounting combined with tape-and-reel packaging ensures robust PCB anchoring and automated assembly compatibility for high-volume production lines
Applications
The TSM-134-02-TM-DH-A-K-TR is suited for high-density signal routing in industrial control systems, data acquisition boards, and embedded computing modules where 68 contacts at 0.100" pitch need both reliable SMD soldering and mechanical retention via clinch posts. The mid-height dual-row profile accommodates medium stacking height constraints in multi-board enclosure designs, and tape-and-reel packaging enables volume automated assembly.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the total pin count and physical pitch for TSM-134-02-TM-DH-A-K-TR?
TSM-134-02-TM-DH-A-K-TR provides 68 positions in a dual-row (2x34) arrangement at a 0.100 inch (2.54 mm) pitch. With 34 columns, the connector spans approximately 3.3 inches, making it appropriate for high signal-count board interconnect tasks in industrial controllers, data acquisition modules, and embedded system expansion cards requiring dense 2.54mm dual-row SMD contacts.
How does the TM (mid-height) body style of TSM-134-02-TM-DH-A-K-TR differ from TL (low-profile) and standard TSM body styles?
The TM variant offers a mid-height body between the low-profile TL and standard TSM heights, providing intermediate board clearance at 0.100 inch pitch. This mid-height profile suits enclosure designs where the low-profile TL would leave insufficient mating clearance but the standard height would exceed the available vertical space between stacked 68-position boards in the system packaging.
Does the tape-and-reel packaging of TSM-134-02-TM-DH-A-K-TR support pick-and-place assembly for the entire 68-position connector at once?
Yes, the TR (tape-and-reel) format presents each TSM-134-02-TM-DH-A-K-TR connector as a single component in the carrier tape, so a pick-and-place machine places the entire 68-position dual-row body at once onto the 0.100 inch pitch footprint. This dramatically reduces placement cycle time compared to manual insertion or tray-packaged components, supporting high-throughput SMD assembly in volume PCB manufacturing.
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