TSM-134-01-T-DH-A-P-TR SAMTEC Connector (Other) In Stock
TSM-134-01-T-DH-A-P-TR is a SAMTEC 68-position dual-row surface-mount terminal strip on 2.54 mm (0.100 inch) pitch in tape-and-reel packaging for high-volume automated SMT assembly. Delivers dense 68-signal wire-to-board or board-to-board connectivity in a compact single-connector footprint. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 68
- Lifecycle
- ACTIVE
- Datasheet
- TSM-134-01-T-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-134-01-T-DH-A-P-TR?
- 68 positions on 2.54 mm (0.100 inch) pitch dual-row SMT layout routes 68 independent signals through a single connector, reducing board area and assembly steps
- Tape-and-reel (-TR) packaging enables high-speed pick-and-place automated assembly, lowering per-unit labor cost for high pin-count interconnect in production runs
- SAMTEC TSM series dual-row header supports mating with standard 2.54 mm pitch IDC ribbon cable assemblies widely available for rapid prototyping and production
What is TSM-134-01-T-DH-A-P-TR used for?
TSM-134-01-T-DH-A-P-TR is used in FPGA development boards, SBC expansion headers, and industrial backplane modules where 68 signals must traverse a single board-edge or board-to-board interface. Its tape-and-reel packaging and SMT termination support automated assembly in telecom daughter cards and multi-channel data acquisition systems at production volumes. Prototype platforms also rely on this connector for GPIO and peripheral bus expansion using standard 2.54 mm pitch ribbon cables.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-134-01-T-DH-A-P-TR datasheet?
TSM-134-01-T-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-134-01-T-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does TSM-134-01-T-DH-A-P-TR provide, and how are they physically arranged?
TSM-134-01-T-DH-A-P-TR has 68 total positions arranged in a dual-row (2 rows × 34) configuration on a 2.54 mm (0.100 inch) pitch. The dual-row SMT layout spans approximately 86 mm of board length, concentrating 68 signal paths into a single compact footprint that would otherwise require two separate 34-pin connectors and additional PCB routing area between them.
Does TSM-134-01-T-DH-A-P-TR support automated assembly, and what packaging does it use?
Yes, TSM-134-01-T-DH-A-P-TR is supplied in tape-and-reel (-TR) format, which is fully compatible with IPC-7711 SMT pick-and-place equipment. Tape-and-reel delivery enables placement rates of 3,000 to 8,000 components per hour on modern assembly lines, eliminating the manual insertion step required for bulk or tray-packed high-pin-count connectors and maintaining consistent component orientation for 68-position solder joint quality.
Which bus interfaces or expansion protocols can 68-pin TSM-134-01-T-DH-A-P-TR support simultaneously?
With 68 pins, TSM-134-01-T-DH-A-P-TR can simultaneously carry a 32-bit parallel data bus, 8 address or control lines, 8 GPIO signals, and 20 power or ground pins, making it suitable for FPGA expansion buses, parallel memory interfaces, or custom backplane protocols. Alternatively, it can host two separate 32-pin LVDS channel groups with dedicated grounds when the pin assignment reserves every other row pin as a signal return, achieving impedance-controlled differential routing across the connector.
How does TSM-134-01-T-DH-A-P-TR differ from TSM-135-03-H-DH-A-P-TR in pin count and application scope?
TSM-134-01-T-DH-A-P-TR has 68 pins versus 70 pins on TSM-135-03-H-DH-A-P-TR, a difference of 2 positions that affects only applications counting pins very precisely for specific bus widths. The '-01-T' versus '-03-H' segment of the MPN encodes differences in contact tail length and shroud height, with the TSM-134 variant typically using a shorter 3.0 mm tail suited to thinner PCB stackups of 1.0 mm to 1.6 mm compared to the taller profile of the TSM-135 series.
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