TSM-133-04-TM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-133-04-TM-DH-A-K-TR is a 66-position dual-row surface mount terminal strip with 2.54 mm pitch, gold-plated contacts, and tape-and-reel packaging for automated PCB assembly in industrial and embedded systems.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-133-04-TM-DH-A-K-TR?
- 66-position dual-row layout at 2.54 mm pitch for high-density surface mount board connections
- Gold-plated contacts ensure low contact resistance and long-term reliability in harsh environments
- Tape-and-reel (TR) packaging enables high-speed automated pick-and-place assembly
- Surface mount termination style eliminates through-hole drilling, reducing PCB fabrication cost
What is TSM-133-04-TM-DH-A-K-TR used for?
The TSM-133-04-TM-DH-A-K-TR is well suited for surface mount interconnect applications in embedded computing modules, industrial control boards, and telecommunications backplane designs requiring high pin count in a compact footprint. Its dual-row 66-position layout supports dense signal routing between mezzanine cards and motherboards. The tape-and-reel packaging makes it ideal for high-volume automated assembly lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-133-04-TM-DH-A-K-TR datasheet?
TSM-133-04-TM-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-133-04-TM-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin count and pitch of the TSM-133-04-TM-DH-A-K-TR?
The TSM-133-04-TM-DH-A-K-TR has 66 total positions arranged in a dual-row configuration at a 2.54 mm (0.100 inch) pitch. This standard pitch provides broad compatibility with mating connectors in embedded computing and industrial PCB designs.
How does the surface mount termination style of TSM-133-04-TM-DH-A-K-TR benefit PCB designers?
The surface mount termination eliminates the need for through-hole drilling, reducing PCB fabrication cost and enabling placement on both sides of a board. It also supports automated solder reflow processes, achieving consistent joint quality at production volumes of thousands of units.
Why choose the tape-and-reel variant (TR suffix) of TSM-133-04-TM-DH-A-K-TR for production?
The TR (tape-and-reel) packaging is compatible with standard IEC 60286-3 reel formats for automated pick-and-place machines, supporting placement rates above 10,000 components per hour and reducing manual handling errors during high-volume SMT production runs.
Which application scenarios benefit most from the TSM-133-04-TM-DH-A-K-TR 66-pin dual-row format?
Applications with high signal density requirements such as FPGA mezzanine cards, CPU daughter boards, and multi-channel data acquisition systems benefit most. The 66-pin dual-row format can route up to 33 differential pairs or 66 single-ended signals across a single connector footprint, significantly reducing board area compared to multiple smaller connectors.
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