TSM-133-04-T-DH-A-K-TR SAMTEC Connector (Other) In Stock
TSM-133-04-T-DH-A-K-TR is a SAMTEC 66-position four-row surface mount terminal strip with 2.54 mm (0.100") pitch for very high-density PCB signal interconnection. The four-row configuration maximizes pin density in a compact SMT footprint. Available from stock worldwide with standard shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- TSM-133-04-T-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-133-04-T-DH-A-K-TR?
- 66-position four-row layout at 2.54 mm (0.100 inch) pitch provides exceptional pin density for complex bus and mixed-signal PCB interconnects
- Surface mount termination with tape-and-reel packaging (TR) enables automated high-volume pick-and-place and reflow assembly
- SAMTEC TSM series construction maintains precise 66-pin contact alignment across four rows for reliable signal integrity in digital and mixed-signal designs
What is TSM-133-04-T-DH-A-K-TR used for?
The TSM-133-04-T-DH-A-K-TR is used in high-pin-count FPGA interface cards, complex backplane connectors, and multi-bus embedded computing boards requiring 66-pin four-row SMT connectivity at 2.54 mm pitch. Its four-row design concentrates signal density into a compact rectangular footprint, reducing the PCB area required for wide parallel bus connections. The tape-and-reel packaging supports efficient automated assembly in high-volume electronic manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-133-04-T-DH-A-K-TR datasheet?
TSM-133-04-T-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-133-04-T-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the four-row configuration of TSM-133-04-T-DH-A-K-TR maximize pin density compared to single-row alternatives?
The four-row arrangement of TSM-133-04-T-DH-A-K-TR places 66 contacts in a grid at 2.54 mm pitch, reducing the connector body length by approximately 75% compared to a single-row 66-pin strip of the same pitch. This compaction is critical in PCB designs with limited board edge space or where multiple bus connectors must fit within a defined footprint area.
Does the tape-and-reel (TR) packaging of TSM-133-04-T-DH-A-K-TR support automated SMT assembly?
Yes, the TR suffix indicates tape-and-reel packaging, which is compatible with standard pick-and-place equipment used in automated SMT lines. This enables precise component placement at typical machine speeds, supports reflow soldering at up to 260°C, and reduces per-unit handling time compared to tray-packaged connectors in high-volume production.
Which wide parallel bus interface designs benefit most from the 66-position TSM-133-04-T-DH-A-K-TR?
The 66-position TSM-133-04-T-DH-A-K-TR accommodates wide parallel buses such as 64-bit data buses with 2 control lines, or combined 32-bit address and 32-bit data buses with 2 enable signals commonly found in SDRAM controllers and FPGA memory interface designs. Its four-row layout at 2.54 mm pitch keeps the connector footprint under 25 mm on its longest dimension.
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