TSM-133-04-L-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-133-04-L-DH-A-K-TR is a 66-position, 0.100" pitch dual-row surface mount terminal strip with standard mating height and keying for secure assembly. Supports high pin-count daughter card and backplane interconnects with error-proof alignment. Available in tape-and-reel packaging with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- TSM-133-04-L-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-133-04-L-DH-A-K-TR?
- 66-position dual-row SMT terminal strip at 0.100" (2.54 mm) pitch for high-density PCB signal and power routing
- Keying (K) feature prevents mismating in assemblies with multiple high-pin-count headers on a single board
- Tape-and-reel (TR) packaging ensures compatibility with automated SMT pick-and-place equipment for volume production
What is TSM-133-04-L-DH-A-K-TR used for?
The TSM-133-04-L-DH-A-K-TR is used in backplane architectures, FPGA development boards, and industrial computing systems where a single connector must carry 66 signals at 0.100" pitch. Its keyed dual-row design prevents critical mating errors in multi-connector telecom shelf assemblies and defense electronics modules. The tape-and-reel delivery enables seamless integration into automated SMT production for high-volume board builds.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-133-04-L-DH-A-K-TR datasheet?
TSM-133-04-L-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-133-04-L-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contacts per row does the TSM-133-04-L-DH-A-K-TR provide at 0.100" pitch?
The TSM-133-04-L-DH-A-K-TR has 66 total contact positions arranged in a dual-row layout at 0.100" (2.54 mm) pitch, with 33 contacts per row. This high pin count in a single SMT connector is well suited for FPGA I/O headers, backplane interconnects, and large DSP module interfaces requiring dense signal routing.
In which large-scale embedded or backplane systems is the TSM-133-04-L-DH-A-K-TR most commonly deployed?
The TSM-133-04-L-DH-A-K-TR is commonly deployed in FPGA development platforms with 66+ I/O signals, telecommunications backplane cards requiring high-density 0.100" pitch headers, and military-grade embedded computing chassis where a single reliable SMT connector must handle 66 discrete signals. Its keying prevents the costly assembly errors that can occur in complex backplane environments with dozens of similar connectors.
Does the TSM-133-04-L-DH-A-K-TR support automated SMT assembly for high-volume production?
Yes. The TSM-133-04-L-DH-A-K-TR is supplied in tape-and-reel (TR) packaging compatible with standard automated pick-and-place machines. Its 66-position SMT footprint at 0.100" pitch allows reflow soldering in a single pass, and the consistent reel format ensures accurate component placement at production rates suitable for thousands of boards per shift in contract electronics manufacturing.
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