TSM-133-04-F-SH-A SAMTEC Connector (Other) In Stock
SAMTEC TSM-133-04-F-SH-A is a 33-position, dual-row, .100 inch pitch surface mount terminal strip in horizontal orientation. Its 66-pin layout enables high-density board-to-board signal routing with SMT-compatible assembly. Available in stock with worldwide shipping from authorized distributors.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 33
- Lifecycle
- ACTIVE
- Datasheet
- TSM-133-04-F-SH-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-133-04-F-SH-A?
- 33-position dual-row layout with 66 pins at .100 inch (2.54 mm) pitch for high-density SMT connectivity
- Horizontal surface mount orientation enables low-profile PCB integration with standard reflow-compatible assembly
- RoHS-compliant Samtec construction designed for reliable industrial, embedded, and telecommunications interconnect applications
What is TSM-133-04-F-SH-A used for?
The TSM-133-04-F-SH-A is well-suited for board-to-board and wire-to-board interconnect applications in industrial control, telecommunications equipment, and embedded computing systems. Its 33-position dual-row layout with 66 pins at a 2.54 mm pitch supports high-density signal routing in rack-mounted and panel-mount designs. The horizontal SMT footprint simplifies automated assembly and reduces PCB real estate requirements.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-133-04-F-SH-A datasheet?
TSM-133-04-F-SH-A Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-133-04-F-SH-A?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many pins does the TSM-133-04-F-SH-A contain and what connector pitch does it use?
The TSM-133-04-F-SH-A is a 33-position dual-row connector with a total of 66 pins arranged at a .100 inch (2.54 mm) pitch, enabling compatibility with standard SMT PCB grid layouts used in industrial and embedded designs.
Which board-to-board communication scenarios benefit most from the dual-row layout of the TSM-133-04-F-SH-A?
Dual-row configurations with 66 pins at 2.54 mm pitch are ideal for backplane interconnects in industrial automation, rack-mounted test equipment, and embedded computing where signal density is critical and SMT horizontal assembly is preferred.
How does the TSM-133-04-F-SH-A compare to single-row terminal strips for modular system designs?
Compared to single-row strips, the TSM-133-04-F-SH-A dual-row layout provides 66 pins in approximately half the board length, reducing PCB real estate while maintaining a standard .100 inch (2.54 mm) pitch and an SMT-compatible horizontal footprint.
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