TSM-133-03-TM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-133-03-TM-DH-A-K-TR is a 66-position surface mount terminal strip with 0.100" (2.54 mm) pitch in a dual-high profile. Designed for high pin-count board interconnects, it offers reliable surface mount termination and tape-and-reel packaging for automated PCB assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-133-03-TM-DH-A-K-TR?
- 66-position dual-high surface mount terminal strip at 0.100" (2.54 mm) pitch for maximum signal density per connector
- Tape-and-reel (TR) packaging enables fully automated pick-and-place assembly for high-volume PCB production
- Dual-high (DH) design increases vertical contact density while maintaining the standard 0.100" pitch footprint
- Surface mount termination supports standard SMT reflow processes, eliminating through-hole drilling and reducing board fabrication costs
What is TSM-133-03-TM-DH-A-K-TR used for?
The TSM-133-03-TM-DH-A-K-TR is suited for high pin-count signal distribution in backplane systems, industrial control cards, and prototype development boards requiring 0.100" pitch interconnects. Its 66-position dual-high surface mount design enables dense wiring in communications infrastructure, embedded computing platforms, and laboratory test equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-133-03-TM-DH-A-K-TR datasheet?
TSM-133-03-TM-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-133-03-TM-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-133-03-TM-DH-A-K-TR terminal strip provide and at what pitch?
The TSM-133-03-TM-DH-A-K-TR provides 66 positions at a 0.100" (2.54 mm) pitch in a dual-high surface mount format. This high pin-count layout accommodates wide parallel signal buses, mixed power and signal routing, and dense control interfaces in a single compact connector footprint.
What does the dual-high (DH) designation mean for the TSM-133-03-TM-DH-A-K-TR?
The dual-high designation indicates that the TSM-133-03-TM-DH-A-K-TR has an elevated profile with two stacked contact rows at 0.100" pitch, increasing vertical contact density. This design is used when boards need more signal lines than a single row can supply while maintaining the widely available 2.54 mm pitch footprint and surface mount termination style.
Which assembly processes are supported by the TSM-133-03-TM-DH-A-K-TR tape-and-reel packaging?
Tape-and-reel (TR) packaging makes the TSM-133-03-TM-DH-A-K-TR directly compatible with automated pick-and-place machines, supporting high-throughput SMT production lines. Standard reflow soldering profiles apply to its surface mount termination, providing repeatable, inspection-friendly solder joints across all 66 positions in a single assembly pass.
For what kind of development board applications is the TSM-133-03-TM-DH-A-K-TR a practical choice?
The 66-position 0.100" pitch dual-high format of the TSM-133-03-TM-DH-A-K-TR is practical for FPGA evaluation boards, microcontroller development platforms, and laboratory prototype boards where standard 2.54 mm pitch tooling is available. Designers can connect logic analyzers, expansion headers, or ribbon cable assemblies to all 66 positions using widely sourced mating connectors.
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