TSM-133-03-SM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-133-03-SM-DH-A-K-TR is a 66-position dual-row surface mount terminal strip with 0.100 inch pitch, suitable for high-density PCB interconnects. Features SMT termination for automated assembly. Available in stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-133-03-SM-DH-A-K-TR?
- 66-position dual-row layout at 0.100 inch (2.54 mm) pitch enabling high-density PCB signal routing in compact form factors
- Surface mount termination style supports automated pick-and-place and reflow soldering for high-volume production efficiency
- Tape-and-reel (TR) packaging ensures compatibility with automated SMT assembly lines, reducing handling time and placement errors
What is TSM-133-03-SM-DH-A-K-TR used for?
The SAMTEC TSM-133-03-SM-DH-A-K-TR is ideal for high-density PCB-to-PCB and board-to-module interconnect applications in industrial automation, test and measurement equipment, and communication systems. Its 66-position dual-row 0.100 inch pitch configuration supports a large number of signal and power connections in a minimal board footprint. The surface mount format and tape-and-reel packaging make it well-suited for high-throughput automated SMT production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-133-03-SM-DH-A-K-TR datasheet?
TSM-133-03-SM-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-133-03-SM-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the position count and pitch of the SAMTEC TSM-133-03-SM-DH-A-K-TR terminal strip?
The TSM-133-03-SM-DH-A-K-TR is a 66-position dual-row terminal strip with a 0.100 inch (2.54 mm) pitch. The dual-row, 33-pins-per-row layout provides 66 individual contact points, making it suitable for applications requiring high pin density in a surface mount configuration with standard 0.1 inch grid spacing.
For which PCB assembly processes is TSM-133-03-SM-DH-A-K-TR optimized?
The TSM-133-03-SM-DH-A-K-TR features surface mount termination and ships in tape-and-reel (TR) format, making it fully compatible with automated SMT pick-and-place equipment and reflow soldering at standard lead-free temperatures up to 260°C. This eliminates manual insertion labor and ensures consistent placement accuracy across high-volume production runs.
How does the TSM-133-03-SM-DH-A-K-TR differ from TSM series parts with fewer positions?
With 66 positions across 2 rows at 0.100 inch pitch, the TSM-133-03-SM-DH-A-K-TR accommodates significantly more signal lines than lower-position-count TSM variants such as 10-position or 20-position strips. This makes it the preferred choice for backplane, FPGA expansion, or data acquisition boards where 66 or more simultaneous signal connections are required in a single compact SMT header.
What board space does the 66-position dual-row 0.100 inch pitch footprint of TSM-133-03-SM-DH-A-K-TR occupy?
At 0.100 inch (2.54 mm) pitch with 33 positions per row and 2 rows, the TSM-133-03-SM-DH-A-K-TR occupies approximately 3.3 inches (83.8 mm) in length and 0.1 inch (2.54 mm) in row spacing on the PCB. This compact dual-row footprint maximizes contact density per unit board area compared to single-row headers of equivalent position count.
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