TSM-133-03-H-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-133-03-H-DH-A-P-TR is a 66-position dual-row surface-mount terminal strip with 0.100 inch (2.54 mm) pitch. It features a through-hole-compatible footprint and tape-and-reel packaging for automated SMT assembly in high-density PCB applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- TSM-133-03-H-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 66-position dual-row layout with 0.100 inch pitch for high-density signal interconnect
- Surface-mount terminal strip design compatible with automated tape-and-reel pick-and-place assembly
- Robust contact retention and reliable mating force supporting mixed signal and power distribution applications
Applications
The TSM-133-03-H-DH-A-P-TR is used in backplane and board-to-board interconnect designs requiring 66 positions at 0.100 inch pitch in a surface-mount package. It is well suited for embedded computing modules, FPGA development boards, and industrial control systems where high pin-count board-stacking is needed. The tape-and-reel format supports high-volume automated SMT assembly lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the TSM-133-03-H-DH-A-P-TR connector offer?
The TSM-133-03-H-DH-A-P-TR provides 66 positions arranged in a dual-row layout with 0.100 inch (2.54 mm) pitch. This configuration allows a large number of signal and power connections within a compact 0.100 inch grid, making it suitable for dense PCB interconnect designs.
Is TSM-133-03-H-DH-A-P-TR suitable for automated SMT production lines?
Yes, the TSM-133-03-H-DH-A-P-TR is packaged in tape-and-reel format, enabling automated pick-and-place assembly on standard SMT production lines. The surface-mount terminal strip body positions consistently on pads at 0.100 inch pitch, reducing manual handling and improving throughput in high-volume manufacturing.
What types of embedded or industrial board designs commonly use the TSM-133-03-H-DH-A-P-TR?
FPGA development boards, embedded processor modules, and industrial PLC backplanes commonly use this 66-position 0.100 inch pitch surface-mount strip to stack boards or connect daughter cards. The dual-row layout distributes 66 signals across a minimal PCB footprint, saving board space in compact control and communication equipment.
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