TSM-133-03-FM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-133-03-FM-DH-A-K-TR is a 66-position, 0.100" (2.54mm) pitch surface mount terminal strip with dual-row configuration for high-density PCB interconnects. It features a robust through-hole compatible footprint with reliable surface mount termination for board-to-board and wire-to-board applications. Available in stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-133-03-FM-DH-A-K-TR?
- 66-position dual-row surface mount terminal strip with 0.100" (2.54mm) pitch for high-density signal routing
- Surface mount design enables automated PCB assembly with tape-and-reel packaging option for volume production
- Compatible with SAMTEC mating connectors for reliable board-to-board or board-to-wire interconnect systems
What is TSM-133-03-FM-DH-A-K-TR used for?
The TSM-133-03-FM-DH-A-K-TR is used in backplane systems, embedded computing boards, and modular industrial equipment where a large number of signal connections—up to 66 positions—must be accommodated in a 0.100" grid. Its surface mount footprint is also well-suited for test fixtures, development boards, and data acquisition systems requiring dense multi-signal interface strips.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-133-03-FM-DH-A-K-TR datasheet?
TSM-133-03-FM-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-133-03-FM-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does TSM-133-03-FM-DH-A-K-TR provide and what is its pitch?
The TSM-133-03-FM-DH-A-K-TR provides 66 positions arranged on a 0.100" (2.54mm) pitch, making it one of the larger terminal strips in the SAMTEC TSM series. This high pin count suits backplane designs, embedded computing carrier boards, or any application requiring a dense surface mount signal interface with standard 2.54mm grid spacing.
Which PCB assembly processes are compatible with TSM-133-03-FM-DH-A-K-TR?
The TSM-133-03-FM-DH-A-K-TR is designed for surface mount assembly, compatible with standard SMT reflow soldering processes. The tape-and-reel (TR) packaging suffix indicates the part ships in carrier tape suitable for automated pick-and-place equipment, supporting high-volume PCB manufacturing. Its 0.100" pitch pads align with standard SMT footprint libraries.
When should an engineer choose TSM-133-03-FM-DH-A-K-TR over a lower pin-count terminal strip like TSM-119?
TSM-133-03-FM-DH-A-K-TR with 66 positions is preferable over a 38-position strip such as TSM-119 when the design requires more than 38 signal or power connections in a single connector zone. Applications such as FPGA daughter card interfaces, multi-channel ADC boards, or large SoM carrier boards that route 50 or more signals benefit from the higher contact density of the 66-position variant.
What is the row configuration of TSM-133-03-FM-DH-A-K-TR and how does it affect PCB layout?
The TSM-133-03-FM-DH-A-K-TR uses a dual-row configuration with 0.100" (2.54mm) pitch between columns and rows, distributing 66 contacts across 2 rows of 33 pins each. This dual-row layout reduces the connector's length on the PCB compared to a single-row arrangement, which is advantageous in compact layouts where board edge space is limited and signal density must be maximized.
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