TSM-133-03-F-DH-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-133-03-F-DH-P-TR is a 66-position triple-row surface mount terminal strip on 0.100" (2.54 mm) pitch, featuring a dual-height body and press-fit (P) retention pegs for secure PCB mounting. Ideal for industrial and embedded systems requiring dense three-row 0.100" connectivity in SMT packages. From $3.00 in stock, worldwide shipping available.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- TSM-133-03-F-DH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-133-03-F-DH-P-TR?
- 66-position triple-row layout on 0.100" (2.54 mm) pitch allows 22 contacts per row in a compact SMT footprint
- Press-fit (P) retention pegs mechanically lock the connector to the PCB before soldering, improving assembly accuracy
- Dual-height (DH) body provides elevated standoff for mezzanine board stacking applications
What is TSM-133-03-F-DH-P-TR used for?
TSM-133-03-F-DH-P-TR is well-suited for embedded computing backplanes, industrial PLC expansion modules, and FPGA daughter card interconnects where 66 pins of triple-row 0.100" pitch surface mount connectivity are required. The press-fit retention pegs simplify board assembly by holding the connector in place during reflow soldering. Its dual-height body enables controlled PCB separation in mezzanine stacking architectures.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-133-03-F-DH-P-TR datasheet?
TSM-133-03-F-DH-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-133-03-F-DH-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What advantages do the press-fit retention pegs (P option) offer during PCB assembly of TSM-133-03-F-DH-P-TR?
The press-fit retention pegs snap into PCB mounting holes before soldering, mechanically securing the 66-position connector during SMT reflow at up to 260°C peak temperature. This prevents movement or tombstoning of the component on the 0.100" pitch pads and eliminates the need for manual fixtures or adhesive during automated assembly.
How many contacts per row does the TSM-133-03-F-DH-P-TR provide in its triple-row configuration?
The TSM-133-03-F-DH-P-TR has 66 total positions arranged across 3 rows, yielding 22 contacts per row on the standard 0.100" (2.54 mm) pitch. This triple-row layout delivers higher pin density than a comparable dual-row connector of the same board length, making it suitable for multi-bus or mixed signal-power interfaces.
For what type of mezzanine stack height does the DH body designation prepare TSM-133-03-F-DH-P-TR?
The dual-height (DH) body of TSM-133-03-F-DH-P-TR adds several millimeters of height above standard TSM profiles, enabling stacked PCBs to maintain adequate component clearance between board layers. This is particularly useful in modular systems with tall SMT components such as electrolytic capacitors or transformers mounted near the 0.100" pitch connector zone.
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