TSM-133-02-TM-DH-P-TR SAMTEC Connector (Other) In Stock
Samtec TSM-133-02-TM-DH-P-TR is a 66-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch, mid-board (TM) mounting style, and dual housing for secure high-density SMT board connections. From $1.00, in stock, worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- TSM-133-02-TM-DH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-133-02-TM-DH-P-TR?
- 66-position dual-row terminal strip with 0.100" (2.54 mm) pitch for mid-board SMT signal routing
- Mid-board (TM) mounting style enables flexible connector placement anywhere along the PCB length
- Dual-housing (DH) design increases mechanical rigidity and alignment precision for reliable 66-contact mating
What is TSM-133-02-TM-DH-P-TR used for?
The TSM-133-02-TM-DH-P-TR is suited for mid-board interconnects in industrial automation, test equipment, and embedded computing platforms requiring 66-position dual-row SMT connectivity at a standard 0.100" pitch. Its dual-housing construction and mid-board placement flexibility make it a practical choice for complex multi-board systems where edge connector locations are already occupied.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-133-02-TM-DH-P-TR datasheet?
TSM-133-02-TM-DH-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-133-02-TM-DH-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the mid-board (TM) mounting designation mean for TSM-133-02-TM-DH-P-TR installation?
The mid-board (TM) style indicates that the connector can be placed at any position along the PCB surface rather than only at the board edge. This flexibility allows designers to route 66-position 0.100" pitch connections through the center of the board, optimizing signal layout and reducing trace length.
How does the dual-housing (DH) construction benefit TSM-133-02-TM-DH-P-TR in multi-board assemblies?
The dual-housing adds a secondary retention shell around the 66-position contact array, improving mechanical alignment and resisting lateral movement during mating. This is particularly beneficial in multi-board assemblies where connector misalignment could compromise signal integrity across all 66 contacts.
Can TSM-133-02-TM-DH-P-TR be used in automated SMT assembly and what pitch does it support?
Yes, the TSM-133-02-TM-DH-P-TR is designed for SMT reflow assembly and supports a standard 0.100" (2.54 mm) pitch in a dual-row 66-position format. This makes it fully compatible with automated pick-and-place equipment and standard PCB grid layouts without requiring additional hand-soldering steps.
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