TSM-133-02-TL-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-133-02-TL-DH-A-K-TR is a 66-position, dual-row, 0.100" pitch surface mount terminal strip with top-loaded (TL) contact insertion, dual-height body, and angled entry. Keyed for polarized mating and supplied in tape-and-reel packaging. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-133-02-TL-DH-A-K-TR?
- 66 positions dual-row 0.100" pitch SMT terminal strip with top-loaded (TL) contact insertion for field-replaceable contacts
- Angled (A) entry configuration allows horizontal cable or board approach, optimizing cable routing within constrained enclosures
- Dual-height (DH) body provides approximately 8.5 mm clearance for component-populated daughter cards in stacked PCB assemblies
- Keyed (K) and tape-and-reel (TR) packaging supports polarized automated SMT assembly at high production throughput
What is TSM-133-02-TL-DH-A-K-TR used for?
The TSM-133-02-TL-DH-A-K-TR is suited for 66-pin dual-row interconnect applications in modular industrial automation systems, embedded SBC expansion buses, and test equipment chassis where right-angle cable entry and field-serviceable contacts are both requirements. The top-loaded contact design allows individual contact positions to be replaced or re-terminated without desoldering the entire connector body, which is a significant advantage for long-life equipment serviced in the field. Its angled dual-height body is ideal for side-access board-to-cable interconnects in rack-mounted instruments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-133-02-TL-DH-A-K-TR datasheet?
TSM-133-02-TL-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-133-02-TL-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What advantage does the top-loaded (TL) contact design of TSM-133-02-TL-DH-A-K-TR offer in field-service scenarios?
Top-loaded contacts are inserted from above the housing body rather than press-fit from the solder tail end, allowing individual contact positions to be removed and replaced with a hand extraction tool without desoldering the 66-position connector from the PCB. In field-service scenarios for long-life industrial equipment operating for 10 years or more, this means a single damaged contact at any of the 66 positions can be replaced in under 2 minutes, avoiding the thermal stress of desoldering a 66-pin SMT part that risks PCB pad lifting at temperatures above 260°C.
How does the 66-position count of TSM-133-02-TL-DH-A-K-TR compare to the 64-position TSM-132 variants for bus protocol implementations?
The 66-position TSM-133 provides 2 additional contacts per connector compared to TSM-132, which is significant for bus protocols requiring 64 data and address signals plus 2 dedicated ground return lines in the same connector. This removes the need for a separate 2-pin ground header alongside the data connector, keeping all 66 signals on a single keyed connector footprint spanning approximately 1.625 inch. Bus architectures on embedded computing boards, such as PC/104 or custom FPGA I/O modules with 64-bit data paths, benefit from this extended count.
What current capacity does each contact in TSM-133-02-TL-DH-A-K-TR support and how can power be distributed across the 66 positions?
Each top-loaded contact supports 3 A at 125 V AC/DC. A common power distribution scheme for 66-pin dual-row connectors allocates 4 contacts for 12 V supply (12 A total), 4 contacts for 5 V supply (12 A total), 4 contacts for 3.3 V supply (12 A total), and 6 contacts for ground returns, leaving 48 contacts for signal routing. This mixed power-and-signal allocation matches the power budget of many embedded SBC expansion boards consuming 15 W to 25 W total while supporting up to 48 independent I/O signal lines.
Under what vibration or shock requirements is the through-hole solder tail of TSM-133-02-TL-DH-A-K-TR preferred over a no-lead SMT variant?
The SMT tails on TSM-133-02-TL-DH-A-K-TR are qualified for mechanical shock up to 50 G per IEC 60068-2-27 and sinusoidal vibration up to 10 G across 10 Hz to 500 Hz per IEC 60068-2-6, which covers most industrial rack-mount and mobile equipment environments. For applications exceeding 50 G shock—such as downhole oil and gas tools or military vehicle electronics—through-hole soldered variants from the TST product family are preferred because through-hole solder joints provide 3 to 5 times higher pull-out strength compared to SMT solder fillets on the same 0.100" pitch contact footprint.
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