TSM-133-02-SM-DH-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-133-02-SM-DH-P-TR is a 66-position, dual-row surface mount terminal strip with 0.100" pitch, providing high-density SMT board interconnection with polarized housing. The SM profile offers a slim mated height for space-constrained PCB designs. Available in stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- TSM-133-02-SM-DH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-133-02-SM-DH-P-TR?
- 66 positions in dual-row 0.100" (2.54 mm) pitch for high-density SMT board-to-board interconnect
- SM slim-mount profile reduces mated height for space-constrained PCB stack designs
- Tape-and-reel (TR) packaging supports automated high-volume SMT pick-and-place assembly
What is TSM-133-02-SM-DH-P-TR used for?
The TSM-133-02-SM-DH-P-TR is suited for compact embedded computing boards, industrial I/O modules, and communications backplanes requiring 66 signal channels at 0.100" pitch in a slim SMT profile. Its slim-mount design is particularly advantageous in multi-board stack assemblies where minimizing the overall stack height is critical for fitting within tight mechanical enclosures.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-133-02-SM-DH-P-TR datasheet?
TSM-133-02-SM-DH-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-133-02-SM-DH-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contact positions does the TSM-133-02-SM-DH-P-TR have and how are they arranged on the PCB?
The TSM-133-02-SM-DH-P-TR has 66 contact positions arranged in a dual-row surface mount configuration with 0.100" (2.54 mm) pitch. With 33 contacts per row, this layout supports dense signal routing and mates with compatible dual-row headers for reliable board-to-board or wire-to-board connections.
For a multi-board stack enclosure, how does the SM slim-mount profile of this connector reduce overall system height?
The SM (slim-mount) profile of the TSM-133-02-SM-DH-P-TR provides a reduced mated height compared to standard TSM variants, allowing adjacent PCBs in a stack to be placed closer together. In systems with tight vertical clearance, even a 1 mm to 2 mm reduction in connector mated height can determine whether a design fits within a 1U or sub-50 mm enclosure form factor.
When is the TSM-133-02-SM-DH-P-TR preferred over a 64-position or 68-position variant for signal channel allocation?
The TSM-133-02-SM-DH-P-TR with 66 positions is preferred when a design requires exactly 66 signals — for example, 32 data lines, 16 address lines, 8 control signals, 5 power rails, and 5 grounds — where using a 64-position part would be insufficient and a 68-position part would leave unused contacts. Matching pin count to actual channel requirements minimizes connector cost and PCB footprint for the specific signal budget.
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