TSM-133-02-H-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-133-02-H-DH-A-K-TR is a 66-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch, high-profile dual-height design, and tape-and-reel packaging for automated SMT assembly. Gold-plated contacts ensure reliable signal and power routing in industrial and embedded board interconnect.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- TSM-133-02-H-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-133-02-H-DH-A-K-TR?
- 66-position dual-row SMT terminal strip at 0.100" (2.54 mm) pitch for high-channel-count board interconnect
- High-profile dual-height (DH) design supports variable inter-board spacings in stacked module assemblies
- Tape-and-reel (TR) packaging enables high-speed automated pick-and-place on production PCB assembly lines
What is TSM-133-02-H-DH-A-K-TR used for?
The TSM-133-02-H-DH-A-K-TR is designed for high-channel-count board-to-board and mezzanine interconnect in industrial controllers, embedded computing platforms, and telecommunications line cards. Its 66-position dual-row layout at 2.54 mm pitch routes a large number of signals or mixed power-signal assignments through a single compact SMT connector. The high-profile dual-height variant accommodates taller component landscapes between stacked boards.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-133-02-H-DH-A-K-TR datasheet?
TSM-133-02-H-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-133-02-H-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 66-position count of the TSM-133-02-H-DH-A-K-TR benefit high-channel-count system designs?
With 66 positions in a dual-row 0.100" (2.54 mm) pitch layout, the TSM-133-02-H-DH-A-K-TR routes 66 independent signals or power-ground assignments through a single SMT connector, reducing the number of connectors needed on a board and simplifying PCB routing for industrial controllers and embedded processor systems.
What inter-board spacing does the high-profile dual-height design of the TSM-133-02-H-DH-A-K-TR accommodate?
The high-profile (H) dual-height (DH) design of the TSM-133-02-H-DH-A-K-TR enables mating with taller pin headers, supporting inter-board distances of several millimeters greater than standard-height versions. This is valuable in stacked module designs with tall capacitors or heat sinks occupying space between boards.
When should an engineer choose the TSM-133-02-H-DH-A-K-TR over a lower-position-count SMT strip?
Engineers choose the TSM-133-02-H-DH-A-K-TR when a single connector must carry 66 signals at 2.54 mm pitch, eliminating the need for multiple smaller connectors. Consolidating signals into one 66-pin strip reduces PCB area, connector count, and assembly cost on backplanes and expansion boards with dense I/O requirements.
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