TSM-132-04-SM-DH-A-K-TR SAMTEC Connector (Other) In Stock
Samtec TSM-132-04-SM-DH-A-K-TR is a 64-position single-row surface-mount terminal strip with 0.100-inch pitch, dual-height (DH) body, solder mask defined (SM) pads, and tape-and-reel packaging for automated production. Designed for high-density SMT signal interconnects. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-132-04-SM-DH-A-K-TR?
- 64-position single-row SMT terminal strip at 0.100-inch pitch with solder mask defined (SM) pads for improved SMT solder joint reliability
- Dual-height (DH) body with elevated contact post (-A-) enabling flexible mating in multi-board stacking configurations
- Tape-and-reel (TR) packaging allowing accurate automated pick-and-place assembly at 0.100-inch pitch in high-volume PCB production
What is TSM-132-04-SM-DH-A-K-TR used for?
The TSM-132-04-SM-DH-A-K-TR is designed for high-density SMT signal distribution in embedded computing platforms, FPGA evaluation boards, and industrial automation controllers where 64-position connectivity at 0.100-inch pitch is needed. The solder mask defined pad variant improves solder joint quality and registration accuracy during reflow, making it preferable in designs requiring high assembly yield. The dual-height elevated body suits stacked multi-board enclosures with defined inter-board spacing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-132-04-SM-DH-A-K-TR datasheet?
TSM-132-04-SM-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-132-04-SM-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the solder mask defined (SM) pad option provide compared to the standard non-SM variant?
Solder mask defined (SM) pads use the solder mask opening to define the solderable area rather than the copper pad itself. For the 64-position 0.100-inch pitch SMT strip, this technique reduces solder bridging risk during reflow and can improve solder joint shear strength, which is especially beneficial in high-density assemblies.
Which multi-board stacking designs benefit from the elevated contact height (-A-) of the TSM-132-04-SM-DH-A-K-TR?
The -A- elevated contact post is suited for board stacking configurations where the mating connector on the opposing PCB is offset by a defined gap such as 4 mm or more. This is common in FPGA mezzanine cards, compute module stacks, and industrial I/O expansion boards requiring the 64-position dual-height connector to bridge a fixed inter-board standoff.
Does the TSM-132-04-SM-DH-A-K-TR differ significantly from TSM-132-01-F-DH-P-TR in production use?
The -04- suffix denotes a different contact plating option compared to -01-, while the -SM- pad style and -A- elevated height distinguish this part from standard variants like TSM-132-01-F-DH-P-TR. Both are 64-position 0.100-inch pitch tape-and-reel SMT connectors, but the SM pads and elevated 4 mm post height make the -04-SM-DH-A-K-TR preferable where solder joint precision and stacking clearance matter.
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