TSM-132-04-L-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-132-04-L-DH-A-P-TR is a 64-position dual-row 0.100 inch pitch surface mount terminal strip with low-profile dual-height design, in tape-and-reel packaging for automated SMT assembly. Suitable for high-density board-to-board interconnects with worldwide shipping available from stock.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Datasheet
- TSM-132-04-L-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 64-position dual-row surface mount terminal strip on 0.100 inch (2.54 mm) pitch for high pin-count board interconnects
- Low-profile (L) dual-height (DH) design enables board stacking with reduced vertical clearance requirements on compact PCBs
- Tape-and-reel (TR) format supports high-speed automated pick-and-place assembly with reel quantities up to 1,000 pieces
Applications
The TSM-132-04-L-DH-A-P-TR is designed for high-density surface mount interconnect applications in embedded computing modules, industrial control boards, and data acquisition systems requiring 64 discrete signal paths on a 2.54 mm pitch. Its low-profile dual-height form factor is particularly useful in slim-profile enclosures and stacked PCB designs where vertical space is limited. The tape-and-reel packaging makes this connector a cost-effective choice for high-volume automated SMT production in telecommunications and consumer electronics manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the low-profile (L) designation of the TSM-132-04-L-DH-A-P-TR affect PCB stacking clearance?
The low-profile designation reduces the connector's overall mated height compared to standard-height variants, allowing 2 stacked PCBs to be positioned closer together. This is critical in slim enclosures and compact embedded systems where overall stack height must be minimized while still maintaining 64 positions on a 0.100 inch pitch.
What is the position count and pitch of the TSM-132-04-L-DH-A-P-TR, and how does that compare to a 50-position alternative?
The TSM-132-04-L-DH-A-P-TR provides 64 positions on a 0.100 inch (2.54 mm) pitch in a dual-row arrangement, offering 14 additional signal contacts compared to a 50-position (25-per-row) variant. This makes it the preferred choice when designs require more than 50 discrete signal channels without increasing the connector pitch.
Why is tape-and-reel packaging important for manufacturing with the TSM-132-04-L-DH-A-P-TR?
The tape-and-reel (TR) format allows standard SMT pick-and-place equipment to handle this 64-position connector automatically, improving placement repeatability and throughput on high-volume assembly lines. Reel quantities of 1,000 or more parts reduce changeover frequency, lowering manufacturing cost per unit in telecommunications and industrial electronics production.
Which circuit board applications benefit most from a 64-position, 0.100 inch pitch dual-row SMT connector like the TSM-132-04-L-DH-A-P-TR?
Applications that benefit most include data acquisition modules with multiple sensor inputs, industrial automation controllers routing 64 or more I/O signals between boards, and embedded computing platforms using stacked PCB architectures. The dual-row 0.100 inch pitch provides a compact 32-position-per-row layout while keeping overall board footprint manageable.
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